Associate Technical Fellow

Jobtailor; West Hartford (CT); On-site; USD 130,000 - 190,000; Full time

Job summary

Jobtailor in Hartford, CT, seeks an experienced Mechanical Engineer to lead electronics packaging design for avionics-related projects. You will design assemblies, analyze failure modes, and produce CAD models and data packages using Siemens NX.

You will collaborate with Systems, Electrical, Manufacturing, and Supply Chain teams, perform design reviews, and advocate manufacturability while mentoring junior engineers.

Qualifications

• Bachelor’s degree in mechanical engineering or related field.
• 13+ years of electronics packaging design experience.
• 8+ years of 3D CAD modeling experience, preferably NX.
• Strong knowledge of GD&T and ASME Y14.5 standards.
• Experience with DO-160 and MIL-STD-810 environmental qualification.
• Proficiency with PDM/PLM systems.

Responsibilities

• Perform mechanical design for packaging electronic circuits, including assembly design and test.
• Mitigate failure mechanisms to ensure reliable design.
• Collaborate with multi-discipled teams for design release.
• Create CAD models and final data packages.
• Drive Engineering Changes to closure.
• Mentor less experienced staff.

Skills

Electronics packaging design

Siemens NX

ASME Y14.5 / GD&T

DO-160 / MIL-STD-810

FEA (Ansys / IcePAK / Flowtherm)

Manufacturability

Interconnect failure analysis

Mechanical failure analysis

PDM systems (Teamcenter / Windchill //

MS Office

Communication skills

Mentoring

Education

Bachelor’s degree in mechanical engineering or related field

Tools

Siemens NX

Teamcenter

Windchill

Omnify-ARENA

Ansys

IcePAK

Flowtherm

Job description

Responsibilities

• Perform mechanical design and development associated with packaging electronic circuits, including assembly design, analysis, test, and manufacturing support for both new and existing electronics design projects.
• Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.
• Communicate with a team of multi-disciplined engineers (Systems, Electrical, Manufacturing, Supply Chain, and Configuration Management) for design and release approval.
• Investigate and edit product structures, generate CAD models, 2D/3D drawings and be responsible for the final technical data package.
• Create, edit, review, and drive Engineering Changes to closure.
• Use 3D CAD Design Software (NX) to perform mechanical design of electronic systems, optimizing packaging density, material compatibility, thermal performance, structural performance, reliability, and cost.
• Perform analysis including vibration, temperature, mechanical tolerance, and life.
• Develop a close working relationship with Manufacturing Engineering to ensure the production design is producible.
• Generate models and drawings, review policies, procedures and procedures for gaps, identify and implement improvements.
• Mentor less experienced staff to support knowledge growth.

Requirements

• Bachelor’s degree in mechanical engineering or related field.
• 13+ years of experience in electronics packaging design of Avionics Equipment.
• 8+ years of 3D CAD modeling experience. Preferably with Siemens NX.
• Sound understanding of ASME Y14.5 and GD&T.
• Knowledge of hardware qualification standards DO-160, and MIL–STD-810.
• Experience designing for manufacturability of low to medium volume products.
• Knowledge of FEA (Ansys / IcePAK / Flowtherm).
• Knowledge of electronic interconnect and component failure mechanisms and mitigation techniques.
• Knowledge of mechanical failure analysis of electronic systems.
• PDM knowledge (Teamcenter / Omnify-ARENA / Windchill) preferred.
• MS Office (Word, Excel, Access, PowerPoint, Visio and Outlook).
• Ability to work collaboratively with others and demonstrate effective communication skills.
• Strong work ethic with a track record of completing tasks on schedule.

Core Competencies

Demonstrates expertise in Mechanical Design and Development for Electronics Packaging, utilizing 3D CAD Design Software (Siemens NX) to optimize designs for manufacturability, reliability, and performance. Proficient in Failure Analysis and Engineering Change Management, with a strong focus on collaboration and mentorship within multi-disciplinary teams.