Senior Internal Harnessing and Packaging Engineer – BNS Core Components

Jobtailor; Longmont (CO); On-site; USD 140,000 - 190,000; Full time

Job summary

Jobtailor is seeking a senior engineer to own the design, integration, and production readiness of internal harnessing and packaging for the TeraWave flight product. You will lead transitions to high-rate production, embed DFM/DFA, collaborate with manufacturing and suppliers, and develop 3D/2D deliverables using Altium, Creo, SolidWorks, and Windchill.

Requires 8+ years in electronics packaging, a related engineering degree, and U.S. citizenship or eligibility.

Qualifications

• B.S. degree in Mechanical, Electrical, Aerospace Engineering, or related field.
• 8+ years in electronics packaging and harnessing for complex systems.
• Experience transitioning products from prototype to high-rate production.
• Strong knowledge of IPC/WHMA-A-620 and related quality standards.
• U.S. citizenship or eligible status required.

Responsibilities

• Design, integrate, and ensure production readiness of internal harnessing and packaging.
• Mature designs for space environment and optimize for large-scale automated manufacturing.
• Embed DFM/DFA in all design cycles for harnesses, enclosures, PCB/PCBA’s, and electronic assemblies.
• Lead transitions from low-rate builds to high-rate production.
• Collaborate with manufacturing engineers and suppliers on processes, tooling, and test procedures.
• Create and release detailed 3D models and 2D drawings using Altium, Creo, SolidWorks, and Windchill.
• Oversee structural, thermal, and vibration analysis and develop verification/test campaigns.
• Mentor junior engineers and share best practices.

Skills

Design for Manufacturing

Design for Assembly

Mentoring

Collaboration

Leadership

Education

B.S. degree in Mechanical, Electrical, or Aerospace Engineering

Tools

Altium

Windchill

Creo

SolidWorks

Job description

• Serve as a technical leader responsible for the design, integration, and production readiness of all internal harnessing and packaging within the TeraWave flight product.
• Apply expertise to mature designs, ensuring they are robust for the space environment and optimized for efficient, large-scale, automated manufacturing.
• Proactively embed DFM/DFA principles into all design cycles for internal harnesses, enclosures, PCB/PCBA’s, and electronic assemblies.
• Own and lead the technical effort to transition complex product-internal harnessing and packaging designs from low-rate initial builds to a high-rate production environment.
• Collaborate with manufacturing engineers and suppliers to develop and validate production processes, tooling, and test procedures to achieve required production rates and quality.
• Design and release detailed 3D models and 2D drawings for internal wire harnesses, cable assemblies, and electronics enclosures using Altium, Creo, SolidWorks, and Windchill.
• Oversee and contribute to structural, thermal, and vibration analysis of electronic packaging and develop verification and validation test campaigns (qualification, acceptance, etc.).
• Mentor junior engineers, sharing best practices in design for manufacturing, product internal harness design, and product maturation.

Requirements

• B.S. degree in Mechanical, Electrical, Aerospace Engineering, or a related technical field.
• 8+ years of experience in the design and delivery of electronics packaging and/or harnessing for complex systems as an integrated part of a final product.
• Demonstrated, hands-on experience leading the transition of a product from a prototype/development phase into a high-rate production environment.
• Proven expertise in Design for Manufacturing (DFM), Design for Assembly (DFA), and cost reduction methodologies.
• Strong proficiency with 3D CAD software (Creo/SolidWorks preferred) for harnessing and mechanical design.
• Deep understanding of harness manufacturing processes, standards (e.g., IPC/WHMA-A-620), and quality control.
• Experience working through the full engineering lifecycle, including requirements definition, design, analysis, manufacturing, and testing.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Core Competencies

Demonstrates expertise in the design and production readiness of electronics packaging and harnessing, with a strong focus on Design for Manufacturing (DFM) and Design for Assembly (DFA) principles. Proven ability to lead complex product transitions from prototype to high-rate production while ensuring quality and efficiency.

Highest-signal resume keywords

• Design For Manufacturing (DFM)
• Design For Assembly (DFA)
• 3D CAD Software (Creo/SolidWorks)
• Electronics Packaging Design
• Harness Manufacturing Processes

Hard Skills

• Electronics Packaging Design
• Harness Design
• 3D CAD Software (Creo)
• 3D CAD Software (SolidWorks)
• DFM Principles
• DFA Principles
• Vibration Analysis
• Thermal Analysis
• Verification and Validation Testing
• Cost Reduction Methodologies

Soft Skills

• Mentoring
• Collaboration
• Leadership

Industry Keywords

• IPC/WHMA-A-620
• Engineering Lifecycle
• Production Processes
• Quality Control
• High-Rate Production

Tools & Technologies

• Altium
• Windchill