Assembly Process Technician

Micron Technology; Boise (ID); On-site; USD 54,000 - 74,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Disability insurance

Job summary

Micron Technology, Inc. in Boise, ID is seeking an Assembly Process Technician to perform die attach, wire bonding, and reliability stress testing. You will collect data, troubleshoot equipment, and support ongoing process improvements in a clean manufacturing environment.

The role requires attention to detailed instructions, microscope work, and basic computer skills. This position includes collaboration with engineering on new builds and documentation of production activities.

Qualifications

• Associate degree or equivalent hands-on experience in semiconductor assembly or precision manufacturing.
• Ability to work under microscopes with small components.
• Proficient in data entry, spreadsheets, and test software.
• Strong attention to documentation and process instructions.

Responsibilities

• Perform die attach using automated die bonders, including dispensing conductive adhesives, die placement, alignment, and cure/fire profiles.
• Wire bond assembled devices and verify bond quality against established criteria.
• Set up, run, and monitor electromigration and reliability stress tests.
• Collect, organize, and report test data.
• Perform equipment troubleshooting, preventive maintenance, and calibration support on assembly and test tooling.
• Schedule PMs and service calls with vendor.
• Purchase parts and services through Ariba.
• Leverage Copilot or similar AI tools to summarize shift activities, generate maintenance reports, and document production issues.
• Support implementation of smart-manufacturing initiatives by providing operator feedback on AI tools and automated workflows.
• Follow and help improve written work instructions, process documentation, and safety procedures.
• Partner with engineering on new sample builds, process changes, and failure analysis support.

Skills

Attention to detail

Read and follow technical instructions

Basic computer skills

Microscope work precision

Education

Associate degree in electronics / engineering technology / manufacturing

Tools

Ariba

Copilot / AI tools for reporting

Automated die bonder operation

Job description

JR115204 Assembly Process Technician

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

• Perform die attach using automated die bonders, including dispensing conductive adhesives, die placement, alignment, and cure/fire profiles.
• Wire bond assembled devices and verify bond quality against established criteria.
• Set up, run, and monitor electromigration and reliability stress tests.
• Collect, organize, and report test data.
• Perform equipment troubleshooting, preventive maintenance, and calibration support on assembly and test tooling.
• Schedule PMs and service calls with vendor.
• Purchase parts and services through Ariba.
• Leverage Copilot or similar Artificial Intelligence tools to summarize shift activities, generate maintenance reports, and document production issues.
• Support implementation of smart-manufacturing initiatives by providing operator feedback on AI tools and automated workflows.
• Follow and help improve written work instructions, process documentation, and safety procedures.
• Partner with engineering on new sample builds, process changes, and failure analysis support.

Required Qualifications

• Associate degree in electronics, engineering technology, manufacturing, or a related technical field - or equivalent hands-on experience in semiconductor assembly, test, or a comparable precision manufacturing environment.
• Comfortable working under microscopes and with small-geometry parts requiring fine motor precision.
• Basic computer skills: data entry, spreadsheets, and test-system software.
• Able to read and follow detailed technical work instructions.
• Strong attention to detail and consistent documentation habits.

Preferred Qualifications

• Wire bonding experience - ball or wedge bonding.
• Die attach experience - automated die bonder operation and programming.
• Electromigration (EM) or reliability test experience - stress test setup, high-temperature ovens, parametric data collection.
• Experience with automated assembly equipment setup, recipe editing, and vision/alignment systems.
• Background in a cleanroom or controlled manufacturing environment.

Physical & Work Environment

• Extended periods of microscope work and seated precision assembly.
• Cleanroom gowning as required.
• Handling of chemicals and adhesives per site safety procedures and SDS requirements.

Job Profile(s)

Quality Technician 3

Relocation Level: TBD

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.