Role overview
Own physical implementation work for assigned blocks of advanced AI accelerator ASICs, helping take designs from early floorplanning through tapeout. The role focuses on achieving signoff-quality power, performance, and area results while contributing to implementation methods for complex, multi-block chips.
Responsibilities
- Support floorplanning, macro placement, power planning, and bump planning.
- Run clock tree synthesis, place and route, and routing optimization through timing closure.
- Resolve signal integrity, IR/EM, congestion, DRC, LVS, and other signoff issues; implement ECOs and metal fill.
- Contribute to power-grid methods, congestion analysis, wire estimation, and hierarchical implementation strategies.
- Coordinate implementation deliverables with RTL, synthesis, DFT, package, and backend design partners.
- Support physical-design tapeout signoff for owned blocks.
Requirements
- Hands-on experience implementing ASIC blocks with Innovus-based flows.
- Practical familiarity with physical-design and signoff tools such as ICC2, Tempus, PrimeTime, Voltus, RedHawk, and Calibre.
- Ability to close designs across timing, power, area, congestion, DRC, LVS, EM, and IR constraints.
- Experience contributing to physical implementation from floorplanning through tapeout.
- Ability to collaborate across design and implementation teams on complex chip work.
Benefits and work setup
- Remote-first work, with a company-provided computer and home-office setup.
- Company-paid medical, dental, vision, life, and disability coverage; additional supplemental coverage is available.
- Unlimited paid time off, 13 paid holidays, competitive salary and equity, and a 401(k) with company match.
- Applicants must already be authorized to work in the U.S.; new visa sponsorship is unavailable, though eligible H-1B transfers may be supported.