ALD Precision Process Engineer — Yield & Innovation

Texas Instruments Incorporated

Lehi (UT)

On-site

USD 90,000 - 140,000

Full time

14 days+

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Job summary

Texas Instruments Incorporated in Lehi, UT is seeking an energetic Process Development Engineer to enable new technologies and drive manufacturing-ready processes. The role involves developing processes, influencing integration schemes, and translating roadmaps into actionable projects.

You will apply DOE and SPC to improve yield and work with 300mm deposition platforms, including ALD and CVD, to advance semiconductor manufacturing.

Responsibilities

  • Develop new processes and define processing and equipment requirements for advanced semiconductor applications.
  • Influence process integration schemes and support technology development from pilot work through full-scale manufacturing.
  • Translate roadmap requirements into pathfinding and process development projects.
  • Compile and evaluate test data to determine limits and variables for process specifications.
  • Lead or support projects involving new process concepts, equipment selection, chemistry development, automation, and novel manufacturing approaches.
  • Provide technical engineering support in manufacturing and drive modifications that improve production efficiency and yield.
  • Apply DOE and SPC to identify causes of yield loss and improve quality.
  • Partner with equipment suppliers to define and execute development roadmaps.
  • Work across 300mm deposition platforms, including ALD and CVD systems.

Skills

Process development
Statistical methods
Design of Experiments (DOE)
Statistical Process Control (SPC)

Tools

ALD
CVD
Deposition platforms

Job description

Texas Instruments Incorporated in Lehi, UT is seeking an energetic Process Development Engineer to enable new technologies and drive manufacturing-ready processes. The role involves developing processes, influencing integration schemes, and translating roadmaps into actionable projects.

You will apply DOE and SPC to improve yield and work with 300mm deposition platforms, including ALD and CVD, to advance semiconductor manufacturing.

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