Aerospace Mechanical Design Engineer II

Cesiumastro; Westminster (CO); On-site; USD 96,000 - 125,000; Full time

Benefits offered by this job

Stock options

Benefits package (health, dental, 401k

Job summary

CesiumAstro is seeking a Mechanical Design Engineer II to design mechanical components for satellites and aerospace systems. You will work across development stages from concept through qualification, applying CAD, FEA, and EMI/EMC mitigation techniques to optimize performance and manufacturability.

The ideal candidate will have strong experience in electronics packaging, thermal management, and GD&T, and will communicate design reviews effectively with customers and leadership teams.

Qualifications

• BS or MS in Mechanical or Aerospace Engineering from an accredited university.
• Minimum 2 years in design/analysis of electronics packaging or spacecraft structures.
• Experience with electronics assemblies and collaboration with electrical engineers.
• Proficient in CAD/FEA tools and CNC manufacturing workflows.
• Familiarity with EMI/EMC mitigation techniques and GD&T.

Responsibilities

• Design mechanical components, assemblies, structures, and hardware.
• Perform analyses, tolerance studies, and design trade studies.
• Review drawings, CAD models, and technical documentation.
• Conduct mechanical testing, verification, and validation.
• Develop drawings, 3D models, BOMs, and change documentation.
• Present design reviews to customers and leadership.
• Maintain documentation and ensure data control.
• Support design reviews and product development activities.

Skills

Thermal management

FEA

GD&T

EMI/EMC mitigation

Electronics packaging

Vibration analysis

Thermal simulation

Mechanical design

Design reviews

CAD/SolidWorks

Education

BS or MS in Mechanical or Aerospace Engineering

Tools

SolidWorks

SolidWorks Simulation

FEA CAD Tools

CNC manufacturing

Job description

CesiumAstro is seeking a Mechanical Design Engineer II to design mechanical components for satellites and aerospace systems. You will work across development stages from concept through qualification, applying CAD, FEA, and EMI/EMC mitigation techniques to optimize performance and manufacturability.

The ideal candidate will have strong experience in electronics packaging, thermal management, and GD&T, and will communicate design reviews effectively with customers and leadership teams.