Advanced Thin Films Metals Process Engineer

Intel Corporation

Hillsboro (OR)

On-site

USD 134,000 - 189,000

Full time

7 days ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Intel Corporation in Hillsboro, OR, is seeking a Thin Films Metals Module Development Engineer to lead deposition process development across ALD, CVD, PVD, and related platforms.

You will design and optimize processes to meet device performance, yield and manufacturability, work with metrology, yield, and process integration, and support rapid learning cycles. This role requires on-site presence and collaboration across teams.

Qualifications

  • PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or Chemistry.
  • At least 1+ year in thin film deposition technologies (ALD, CVD, PVD, sputtering, evaporation, or electrochemical deposition).
  • Ability to analyze process data using statistics, troubleshooting, and experimental design.
  • Experience with high-k/metal gate, Cu interconnect, or related device metallization preferred.
  • Strong communication and teamwork skills; able to work in a fast-moving environment.

Responsibilities

  • Own thin film metal deposition process development across ALD, CVD, PVD and related platforms.
  • Design, implement, and optimize processes to meet specs for materials, device performance, yield.
  • Design, execute, and analyze experiments to meet device requirements and yield goals.
  • Collaborate with cross-functional teams including process integration and metrology.
  • Support equipment selection, installation, qualification of first-of-kind equipment.

Skills

Thin film deposition
Data analysis
Cross-functional collaboration
Equipment operation principles

Education

PhD in Materials Science
PhD in Chemical Engineering
PhD in Electrical Engineering
PhD in Mechanical Engineering
PhD in Physics
PhD in Chemistry

Tools

JMP
Excel
Python
R
SQL
XRF
XPS
XRD
SEM
TEM
Ellipsometry

Job description

Intel Corporation in Hillsboro, OR, is seeking a Thin Films Metals Module Development Engineer to lead deposition process development across ALD, CVD, PVD, and related platforms.

You will design and optimize processes to meet device performance, yield and manufacturability, work with metrology, yield, and process integration, and support rapid learning cycles. This role requires on-site presence and collaboration across teams.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Innovative Thin Films Module Engineer (ALD/CVD/PVD)
Innovative Thin Films Module Engineer (ALD/CVD/PVD)

Intel • Hillsboro (OR)

On-site
USD 134,000 - 189,000
Competitive pay
Stock bonuses
Health benefits
Thin Films Module Development Engineer
Thin Films Module Development Engineer

Intel • Hillsboro (OR)

On-site
USD 134,000 - 189,000
Competitive pay
Stock bonuses
Health benefits
Thin Films Module Development Engineer
Thin Films Module Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 189,000
Thin Films Metal Deposition Engineer
Thin Films Metal Deposition Engineer

Talanto • Hillsboro (OR)

Hybrid
USD 134,000 - 189,000
Thin-Film Process Development Engineer (ALD/CVD/PVD)
Thin-Film Process Development Engineer (ALD/CVD/PVD)

Micron Technology, Inc • Boise (ID)

On-site
USD 90,000 - 120,000
Medical, dental, and vision plans
Paid time-off program
Paid family leave
Senior Thin Film Process Engineer — Innovation for 18A/12nm HVM
Senior Thin Film Process Engineer — Innovation for 18A/12nm HVM

Intel • Hillsboro (OR)

Hybrid
USD 155,000 - 299,000
Health benefits
Retirement plans
Vacation
Senior Metals Deposition Process Engineer – ALD
Senior Metals Deposition Process Engineer – ALD

Applied Materials, Inc. • Santa Clara (CA), Northern (KY)

Hybrid
USD 124,000 - 171,000
Senior Field Process Engineer – Thin-Film & PVD/CVD/ALD
Senior Field Process Engineer – Thin-Film & PVD/CVD/ALD

LAM RESEARCH Corporation • Tualatin (OR)

Hybrid
USD 105,000 - 231,000
Comprehensive benefits package
Thin Films Module Development Engineer
Thin Films Module Development Engineer

Talanto • Hillsboro (OR)

Hybrid
USD 134,000 - 189,000
Senior Thin Film Process Engineer — Innovation for 18A/12nm HVM
Senior Thin Film Process Engineer — Innovation for 18A/12nm HVM

Intel • Phoenix (AZ)

Hybrid
USD 155,000 - 299,000
Competitive pay
Stock bonuses
Health benefits
+1