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Intel Corporation in Hillsboro, OR, is seeking a Thin Films Metals Module Development Engineer to lead deposition process development across ALD, CVD, PVD, and related platforms.
You will design and optimize processes to meet device performance, yield and manufacturability, work with metrology, yield, and process integration, and support rapid learning cycles. This role requires on-site presence and collaboration across teams.
Intel Corporation in Hillsboro, OR, is seeking a Thin Films Metals Module Development Engineer to lead deposition process development across ALD, CVD, PVD, and related platforms.
You will design and optimize processes to meet device performance, yield and manufacturability, work with metrology, yield, and process integration, and support rapid learning cycles. This role requires on-site presence and collaboration across teams.