3D Heterogeneous Integration Development Intern (Summer 2027)

GlobalFoundries; Town of Malta (NY); On-site; USD 28,000 - 55,000; Full time

Job summary

GlobalFoundries is seeking a 3D Heterogeneous Integration Development Intern to contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding and interposers. You will work with engineering teams to conduct experiments, analyze data, model processes, and support daily integration and process-development activities.

As an intern you will experience one-on-one mentorship, project-based assignments, and opportunities to network with executives while

Qualifications

• Sophomore or higher pursuing a relevant engineering degree during the internship.
• Minimum 3.0 GPA and in good academic standing.
• English fluency written & verbal.
• Travel up to 10%.
• Able to work at least 40 hours per week during internship.

Responsibilities

• Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
• Analyze and interpret engineering data from experiments, process optimizations, and characterization activities.
• Develop or support process models to improve understanding of advanced packaging and integration performance.
• Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities.
• Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives.
• Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders.

Skills

Design of experiments

Data analysis

Process modeling

Documentation

Collaboration

Communication

Education

Bachelor's or Master's in Electrical Engineering

Bachelor's or Master's in Mechanical Engineering

Bachelor's or Master's in Chemical Engineering

Materials Science

Pursuing PhD in Engineering

Tools

DOE tooling

Job description

About GlobalFoundries

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF's talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.

About GlobalFoundries

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF's talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.

Internship Program Overview

Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you'll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.

Summary Of Role

The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer technologies. The intern will work with engineering teams to conduct experiments, analyze technical data, model processes, and support daily integration and process-development activities.

Essential Responsibilities Include

• Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
• Analyze and interpret engineering data from experiments, process optimizations, and characterization activities.
• Develop or support process models to improve understanding of advanced packaging and integration performance.
• Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities.
• Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives.
• Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• Education – At least a sophomore at time of application and actively pursuing a Bachelor's or Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field through an accredited degree program during the time of internship.
• Must have at least an overall 3.0 GPA and be in good academic standing.
• Language Fluency - English (Written & Verbal)
• Travel - Up to 10%
• Ability to work at least 40 hours per week during the internship.

Preferred Qualifications

• Prior related internship or co-op experience
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
• Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills
• Strong planning & organizational skills
• Currently pursuing a PhD in Engineering or related field through an accredited degree program during the internship
• Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis
• Availability for a six-month co-op assignment is preferred

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Expected Salary Range

$20.00 - $40.00

Expected Salary Range

$0.00 - $0.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law