Wafer Fab Process Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

PVH Corp. in Singapore seeks a senior process engineer to lead advanced semiconductor process modules, including thin film deposition and wafer thinning, aiming for yield, quality, cost, and reliability targets.

You will drive yield improvement, defect reduction, and process transfers to high-volume manufacturing, performing root cause analysis and implementing robust corrective actions while mentoring junior engineers and collaborating with cross-functional teams.

Qualifications

• Bachelor's or Master's degree in engineering or related field required.
• 5+ years' semiconductor wafer fab process experience in thin film deposition and/or thermal processes.
• Strong knowledge of SPC, DOE, and FMEA; able to analyze data and drive improvements.
• Demonstrated leadership in cross-functional technical projects.
• Excellent analytical and communication skills.

Responsibilities

• Own and drive advanced process modules (thin film deposition, wafer thinning, thermal processes).
• Lead yield improvement and defect reduction initiatives using DOE methodologies.
• Drive new process integration and transfer to high-volume manufacturing.
• Perform root cause analysis and implement corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Skills

Leadership

Statistical analysis

Problem solving

Communication

Cross-functional teamwork

Education

Bachelor's or Master's degree in Engineering

PhD in Engineering

Tools

Statistical software (SPC/DOE)

FMEA tools

Job description

Job Summary

Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

• Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high-volume manufacturing.
• Perform root cause analysis and implement robust corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Qualifications

• Bachelor's or Master's degree in Engineering (Electrical, Chemical, Materials, or related).
• At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation.
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
• Demonstrated leadership in cross-functional technical projects.
• Strong analytical, problem-solving, and communication skills

Preferred

• PhD in Engineering (Electrical, Chemical, Materials, or related).
• Six Sigma certification (Green/Black Belt).
• Experience supporting 4\" to 6\" wafer scaling or equivalent manufacturing transition.