Technology Development Thin Film Process Engineer

United Microelectronics Corporation (Singapore Branch); Singapore; On-site; SGD 75,000 - 110,000; Full time

Job summary

United Microelectronics Corporation (Singapore Branch) is seeking a Process Engineer to deepen expertise in semiconductor manufacturing. You will drive design and development experiments to stabilize processes, reduce costs, and increase yield across advanced nodes.

A collaborative atmosphere with multiple engineering groups will help develop strategies and solutions to improve efficiency. The role requires strong process development and troubleshooting skills, leadership in cross-functional

Qualifications

• Bachelor's degree in a listed engineering or physics field.
• At least 2 years of semiconductor foundry module process experience.
• Experience with 22/28 nm nodes or below is highly desirable.
• Able to work in shifts and lead cross-functional projects.

Responsibilities

• Develop and optimize W2W and C2W bonding/debonding processes.
• Evaluate carriers and mounting materials and related processes.
• Develop backside and wafer-bevel film deposition processes.
• Develop low-temperature dielectric deposition processes.
• Develop µ-bump metallization processes including PVD and ECP.
• Define process specs, run experiments, analyze data, and resolve issues.
• Collaborate with cross-functional teams to improve performance and readiness.

Skills

Process development

Troubleshooting

Root cause analysis

Leadership

Cross-functional collaboration

Shift work

Education

Bachelor's Degree in Electronic Engineering, Electrical Electronics, Chemical Engineering, Materials Science, Mechanical Engineering or Physics

Tools

SPC

8D reporting

DOE

FMEA

PMO

Job description

About the role

UMC is a leading global semiconductor foundry company. As a Process Engineer, you will develop your expertise in the semiconductor industry and improve conditions for advanced technologies through design and development experiments to provide more stable processes at lower cost and higher yield. You will establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.

Key responsibilities

• Developing and optimizing wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding and debonding processes.
• Evaluating and selecting suitable carriers, mounting materials, and associated processes.
• Developing backside and wafer-bevel film deposition processes.
• Developing low-temperature dielectric deposition processes.
• Developing micro-bump (µ-bump) metallization processes, including physical vapor deposition (PVD) and electrochemical plating (ECP).
• Defining process specifications, conducting experiments, analyzing data, and resolving process integration and yield issues.
• Collaborating with cross-functional teams to improve process performance, reliability, manufacturability, and production readiness.

About you

• Bachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering or Physics
• Demonstrated experience of at least 2 years in semiconductor foundry module process
• 22/28 nanometer and below advance technology nodes experience is highly desirable
• Strong understanding of process development, optimization and troubleshooting
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
• Ability to analyze complex process issues, identify root causes, and implement effective solutions
• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred
• Able to commit shift work

About us

UMC is a leading global semiconductor foundry company.