Technical Solution Engineer

Heraeus Materials Singapore Pte Ltd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Heraeus Materials Singapore Pte Ltd in Singapore is seeking a Senior Technical Support Engineer to provide technical support for solder wire, solder paste for Die Attach, SMT and SiP, and sinter paste across APAC. You will lead customer projects, train customers, and collaborate with R&D to define specs and new products.

The role requires a Bachelor’s degree in Materials/Mechanical Engineering with at least 10 years in semiconductor solder paste and SMT manufacturing, plus strong DOE and data

Qualifications

• Bachelor’s degree in Material/Mechanical Engineering or equivalent practical experience.
• 10+ years hands-on experience in semiconductor solder paste and SMT manufacturing processes.
• Strong skill sets in operating SMT machines, lab equipment, DOE, FA & CSAM.
• Proficient in Minitab and JMP for data analysis and process improvement.
• Excellent verbal and written communication skills in English.

Responsibilities

• Provide technical support for Heraeus Assembly Materials products across APAC.
• Deliver technical training and manage customer-related technical challenges and development projects.
• Lead customer-specific projects and drive tailored technical solutions.
• Collaborate with Product Marketing and R&D to define specs and support new product introductions.
• Support issue investigation and communication of corrective actions via 8D reports.
• Provide technical consultation and guidance throughout the customer lifecycle.
• On-site customer support with understanding of product, process flow and equipment.

Skills

Solder paste tech

DOE

FA & CSAM

Data analysis (Minitab/JMP)

Lab equipment operation

Problem solving

English communication

Education

Bachelor’s Degree in Material/Mechanical Engineering

Tools

SMT machines

Lab equipment

Minitab

JMP

Process equipment

Job description

• Provide technical support for Heraeus Assembly Materials products, including solder wire, solder paste solutions for Die Attach, SMT, and SiP applications, as well as sinter paste, serving customers across the APAC region.
• Deliver technical training and manage customer-related technical challenges and development projects.
• Lead customer-specific projects and drive the development of tailored technical solutions.
• Collaborate with Product Marketing and R&D teams to define product specifications, perform product characterization, and support the introduction of new products to the market.
• Support customer complaint resolution activities, including issue investigation and communication of corrective actions through 8D reports.
• Provide comprehensive technical and application support throughout the customer lifecycle, from pre-sales consultation to post-sales implementation.
• Partner with Sales Account Managers to identify and pursue new business opportunities and customer development initiatives.
• Support customer sample build requests through Application Support Services and HMSL Lab evaluations.
• Responsible for technical support in assembly materials that include solder wire, solder paste product (for SMT & SiP module) and Pressure/Non-pressure sinter paste for APAC customers. (40%)
• Data collection using all related equipment in the lab, analyze and propose solutions and improvements for enhancing robustness of Heraeus assembly materials. These include collaboration with 3rd party external lab services. (20%)
• Provide technical consultation and guidance to customers on the application of Heraeus assembly materials for customers’ product application. (10%)
• Provide on-site customer support with capabilities and understanding of related Heraeus product, process flow, equipment and process windows for problem solving and analysis.(30%)

Qualifications

Bachelor’s Degree in Material/Mechanical Engineering or equivalent practical experience

Required Skills

Strong skill sets in operating all SMT machines, Lab equipment, Technical Problem Solving, Design of Experiments (DOE), FA & CSAM

Good communication and presentation skills.

Experience Requirements

At least 10 years of hands‑on experience in semiconductor solder paste and SMT manufacturing processes.

Proven experience in power module assembly or System-in-Package (SiP) packaging is an advantage.

Skilled in Minitab and JMP for data analysis and process improvement.

Demonstrated leadership and stakeholder management abilities.

Capable of handling complex technical and operational challenges.

Familiar with EMS & OHS

Strong verbal and written communication skills with effective interpersonal engagement.

Fluent in English, both written and spoken.

Strong analytical thinking and structured problem‑solving approach.

Proficient in the operation of SMT production equipment and laboratory testing tools.

Solid experience in Failure Analysis and CSAM methodologies.

Abilities

Able to converse fluently and eloquently in English.

Preference will be given to local candidates or those who do not require visa sponsorship.