Field Application Engineer

Heraeus Materials Singapore Pte Ltd; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

Heraeus Materials Singapore Pte Ltd is seeking a senior technical specialist to provide technical support and application expertise for Heraeus assembly materials across the APAC region. You will lead customer-specific solutions, assist with new product introductions with Product Marketing and R&D, and manage complaint investigations and 8D reporting.

The role requires at least 10 years hands-on experience in semiconductor solder paste and SMT manufacturing, with knowledge of power module

Qualifications

• Bachelor’s degree in Material/Mechanical Engineering or equivalent practical experience.
• 10+ years hands-on experience in semiconductor solder paste and SMT manufacturing.
• Experience with power module assembly or SiP packaging is a plus.
• Proficient with SMT production equipment and lab testing tools.
• Strong problem solving, DOE, FA & CSAM capabilities.
• Excellent communication and presentation skills.
• Leadership and stakeholder management ability.
• Experience with data analysis and process improvement using Minitab/JMP.

Responsibilities

• Provide technical support and application expertise for Heraeus assembly materials across APAC.
• Lead customer-specific solutions and support new product introductions with Product Marketing and R&D.
• Handle complaint investigations and 8D reporting.
• Work with Sales to drive business opportunities.
• Support customer sample builds and lab evaluations from pre-sales to post-sales.

Skills

SMT machines operation

Lab equipment handling

Technical problem solving

Design of Experiments (DOE)

FA & CSAM

Communication skills

Presentation skills

Leadership

Stakeholder management

Power module assembly

SiP packaging

Minitab

JMP

Data analysis

Process improvement

Education

Bachelor’s Degree in Material/Mechanical Engineering

Tools

Minitab

JMP

Job description

Provide technical support and application expertise for Heraeus Assembly Materials products across the APAC region, including customer training, technical issue resolution, and development projects. Lead customer-specific solutions, support new product introductions with Product Marketing and R&D, handle complaint investigations and 8D reporting, and work closely with Sales to drive business opportunities. Also support customer sample builds and lab evaluations throughout the customer lifecycle, from pre-sales to post-sales support.

Job Responsibilities:

• Responsible for technical support in assembly materials that include solder wire, solder paste product (for SMT & SiP module) and Pressure/Non-pressure sinter paste for APAC customers.
• Data collection using all related equipment in the lab, analyze and propose solutions and improvements for enhancing robustness of Heraeus assembly materials. These include collaboration with 3rd party external lab services.
• Provide technical consultation and guidance to customers on the application of Heraeus assembly materials for customers’ product application.
• Provide on‑site customer support with capabilities and understanding of related Heraeus product, process flow, equipment and process windows for problem solving and analysis.

Job Requirement:

• Bachelor’s Degree in Material/Mechanical Engineering or equivalent practical experience
• Strong skill sets in operating all SMT machines, Lab equipment, Technical Problem Solving, Design of Experiments (DOE), FA & CSAM
• Good communication and presentation skills.
• At least 10 years of hands‑on experience in semiconductor solder paste and SMT manufacturing processes.
• Proven experience in power module assembly or System-in-Package (SiP) packaging is an advantage.
• Skilled in Minitab and JMP for data analysis and process improvement.
• Demonstrated leadership and stakeholder management abilities.
• Capable of handling complex technical and operational challenges.
• Proficient in the operation of SMT production equipment and laboratory testing tools.
• Solid experience in Failure Analysis and CSAM methodologies.