Staff/Senior Engineer -Package Health System and Analytics

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Micron is seeking a Package Health Analyst to advance monitoring, simulation, and characterization in advanced packaging. You will work hands-on in DFT, data analysis, reliability testing to ensure robust packaging solutions.

You will define metrics, develop dashboards, perform defect detection, and collaborate across process, equipment, and reliability teams, applying AI tools to improve product quality.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
• 3+ years of experience in semiconductor industry, preferably packaging, test or reliability engineering.
• Strong data analytics and statistical modeling skills.
• Proficiency in Python/R for data analysis and visualization is a plus.
• Experience with AI/ML tools or statistical modeling.

Responsibilities

• Define quantitative package health metrics.
• Develop detection mechanisms and dashboards for continuous health assessment.
• Perform electrical and mechanical characterization of packages.

Skills

Data analytics

Python/R

AI/ML tools

Statistical modeling

Packaging knowledge

Education

Electrical Engineering

Materials Science

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.

Key Responsibilities

Package Health Metrics & Monitoring

• Define quantitative package health metrics
• Develop detection mechanisms and monitoring dashboards for continuous health assessment
• Perform electrical and mechanical characterization of packages

Inline Defect Characterization

• Implement real-time defect detection and classification (critical vs. non-critical)
• Conduct next-level characterization for critical defects and integrate findings into predictive models

Advanced Analytics & Knowledge Base

• Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes
• Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes

End-to-End Traceability

• Collaborate with process and equipment engineers to establish traceability across wafer, assembly, and test stages
• Develop data pipelines and tools for linking process parameters, equipment signals, and defect signatures

AI Responsibilities

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field
• 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering
• Strong data analytics and statistical modeling skills
• Proficiency in Python/R for data analysis and visualization is a plus
• Experience with AI/ML tools or statistical modeling
• Strong understanding of semiconductor packaging process, material interaction and properties
• Ability to work cross‑functionally with process, equipment, and reliability teams
• Knowledge of defect inspection systems and inline metrology
• Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking)
• Strong problem‑solving and documentation skills
• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.