Staff/Principal Engineer - CMP Advanced NAND

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is looking for a Staff/Principal Engineer to drive CMP process development for next-generation NAND memory parts. The role involves collaborating across disciplines and leading innovation projects, supporting advancements in process techniques.

Candidates should possess a Master's or PhD with significant semiconductor experience, particularly in CMP processes. Strong communication and problem-solving skills are essential, along with hands-on experience with CMP equipment.

Qualifications

• 5-10 years of relevant experience in the semiconductor industry.
• Experience in 300mm wafer fabrication, particularly CMP.
• Proven mentoring and collaboration experience.

Responsibilities

• Develop and optimize CMP procedures to improve product quality.
• Manage experiments to widen process margins.
• Collaborate with vendors for next-generation process integration.

Skills

CMP equipment operation

Optical metrology

Dielectrics/metals CMP process development

Communication skills

Collaboration skills

Education

Master's/PhD in a relevant field

Bachelor's with semiconductor experience

Tools

AMAT equipment

EBARA-300X

Job description

Position Overview

As a Staff/Principal Engineer, you will be part of the NAND research and development dry etch team, driving critical modules and working directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch.

Main Responsibilities

As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures aimed at improving product quality and reliability for the next generation of Micron's memory parts.

Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.

Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.

Initiate and manage experiments to widen process margins and evaluate manufacturability of next node solutions.

Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3‑D NAND nodes.

Incorporate best known manufacturing methods into early development phase of upcoming nodes.

Design and implement advanced process monitoring and control methodologies.

Provide strategic roadmap for N+, N++ and future NAND Nodes.

Serve as a technical expert within Micron, contributing to technical projects for improvements to processes, procedures, and equipment.

Define and lead complex, multi‑functional projects of critical importance to Micron, helping to define strategic direction.

Provide advice and counsel to management on significant technical issues.

Lead and initiate innovation projects through patents/technical papers.

Other Responsibilities

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems.
• Engage with Procurement & Operations Central Teams and other partners locally and globally, pushing for breakthrough solutions.
• Lead or drive team or sites on complex, multi‑disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings.
• Apply AI to streamline workflows, optimize processes, and support innovation by incorporating AI‑driven solutions and enabling data‑driven decision‑making across projects and teams.

Education / Job Requirements

• Master's / PhD with 5-10 years of relevant experience.
• Bachelor's degree with 7-12 years of relevant experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.

Must Have Technical Skills

• Hands‑on experience operating CMP equipment such as AMAT (LKP), EBARA-300X and next‑generation CMP equipment.
• Experience with optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology.
• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes.

Must Have Soft Skills

• Excellent oral and written communication skills, conveying concise and effective messages in local and remote communications.
• Strong collaboration and communication skills (verbal and written).
• Self‑driven, adaptable, and able to manage multiple projects.
• Proven ability to take calculated risks and execute novel solutions.
• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable / Preferred Skills or Experience

• Understanding of general process steps and flow for memory processing planar and vertical NAND memory.
• Strong interest in Data science, modeling, and drive to use/adopt AI to optimize workflows.

Equal Employment Opportunity Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.