STAFF/PRINCIPAL ENGINEER - CMP PROCESS DEV

Micron Technology; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

Micron Technology in Singapore is looking for a Process Development Engineer to support the advancement of next-generation NAND technologies. This position involves leading the characterization and development of CMP processes while collaborating with global teams to enhance manufacturability and performance.

The ideal candidate will have a PhD or equivalent experience with strong analytical skills and technical leadership abilities. This role is critical for driving innovations and ensuring process readiness for high-volume production.

Qualifications

• PhD with ≥5 years or Master's with ≥7 years or Bachelor's with ≥10 years in relevant fields.
• Deep technical expertise in CMP process development and optimizing for advanced nodes.
• Ability to perform root-cause analysis and manage complex projects.

Responsibilities

• Lead CMP process characterization and advanced process development for NAND technologies.
• Collaborate globally to align CMP processes with next-generation requirements.
• Drive improvements in yield, performance, and manufacturability.

Skills

CMP Process Development

Analytical skills

Technical leadership

Cross-functional collaboration

Education

PhD with ≥5 years

Master’s degree with ≥7 years

Bachelor’s degree with ≥10 years

Tools

Data analytics tools (e.g., Y3)

CMP polishing equipment (e.g., EBARA WS, AMAT)

Job description

Job Summary

Micron’s NAND Process Development (PD) Singapore team is seeking a Process Development Engineer to join the Advanced Node Technology Development organization. This role supports rapid deployment of next‑generation NAND technologies through process innovation, margin improvement, and close partnership with manufacturing and global development teams. The successful candidate will play a key role in advancing CMP process capability, manufacturability, and readiness for high‑volume production.

Responsibilities

• Own and lead Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and future technology nodes.
• Collaborate with Process Development teams in Singapore, the US, Taiwan, IDF, and key vendors to develop and integrate CMP processes aligned with next‑generation NAND technology requirements.
• Transfer developed CMP processes to high‑volume manufacturing (Fab10N) and drive continuous improvements in yield, performance, and manufacturability.
• Develop and execute strategies to expand process margins, including consumables development, equipment and hardware evaluations, and testing of novel applications.
• Design, execute, and analyze experiments to validate process robustness, manufacturability, and technology scaling readiness.
• Serve as a technical subject‑matter expert contributing to critical technology decisions, process improvements, and roadmap direction for advanced NAND nodes.

Other Responsibilities

• Identify and implement process simplification and manufacturing optimization opportunities to improve cost, productivity, and cycle time.
• Develop and deploy advanced process monitoring and control methodologies to ensure stable and repeatable manufacturing performance.
• Lead and participate in complex, cross‑functional projects of strategic importance, influencing technical direction and execution outcomes.
• Actively engage with internal partners and external suppliers to drive innovation while ensuring strict adherence to Micron’s Intellectual Property and data protection policies.
• Support knowledge sharing through technical documentation, internal reviews, and intellectual property generation (e.g., patents, technical papers).
• Contribute to continuous global technology development (TD) engagement with suppliers to enable breakthrough solutions for future nodes.
• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.

Qualifications

• PhD with ≥5 years, or Master’s degree with ≥7 years, or Bachelor’s degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in leading edge CMP polishing equipment such as EBARA WS or AMAT.
• Deep technical expertise in CMP Process Development
  • Hands‑on mastery of CMP equipment operation, polishing mechanisms (dielectric and metal), slurries, pads, conditioning, and process optimization for advanced nodes.
  • Strong understanding of integration and structural impacts related to film deposition and CMP within NAND/Memory processes.
• Strong Analytical & Problem Solving Capability
  • Ability to perform root‑cause analysis using data analytics tools (e.g., Y3) and interpret complex experimental data.
  • Possess sound critical decision‑making in ambiguous, high‑impact process or yield scenarios.
  • Working knowledge of Design of Experiments (DoE) for systematic process development.
• Technical Leadership & Cross‑Functional Collaboration
  • Ability to lead and mentor junior CMP engineers, driving technical rigor and standards.
  • Proven collaboration with global and cross‑site teams, including effective communication across local and remote environments.
  • Capability to manage multiple technology development projects concurrently in a fast‑paced, changing environment.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.