Senior Process Development Engineer – CMP Process Development
Micron’s NAND Process Development (PD) Singapore group is looking for a Senior Process Development Engineer to join the Advanced Node team to support TD activities associated with the rapid deployment of technology nodes and process margin improvement work, as well as ensuring extended engagement with manufacturing on upcoming technology nodes.
Responsibilities
- Develop and optimize CMP processes to improve product quality and reliability for the next generation of Micron’s memory parts, focusing on understanding and improving the process margins required to meet the mature yield goal for 3D NAND parts.
- Perform fundamental research, consumables development, and hardware evaluation in advanced 3D NAND CMP process development, and test processes for novel applications.
- Initiate and manage experiments to widen process margins and evaluate manufacturability of next node solutions.
- Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes.
- Incorporate best known manufacturing methods into the early development phase of upcoming nodes.
- Design and implement advanced process monitoring and control methodologies.
- Provide a strategic roadmap for N+, N++ and future NAND Nodes.
- Function in a technical advisory role within Micron, contributing to technical projects for improvements to processes, procedures, and equipment.
- Define and lead complex, multi-functional projects of critical importance to Micron, helping to define strategic direction.
- Provide advice and counsel to management on significant technical issues.
- Lead and initiate innovation projects through patents and technical papers.
- Communicate and collaborate with associates both within the region and internationally.
- Adhere strictly to Micron Intellectual Property Protection policy.
- Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems.
- Engage with Procurement & Operations Central Teams and other partners locally and globally to push for breakthrough solutions.
- Lead or drive teams or sites on complex, multi-disciplinary projects in quality-focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings.
Qualifications
- Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics with a minimum of 1 year of relevant experience in the semiconductor industry, specifically in Chemical Mechanical Planarization (CMP) on 300mm wafer fabrication.
- Hands‑on experience with CMP equipment operation such as AMAT (LKP), EBARA‑300X, and next‑generation CMP equipment.
- Proficiency in optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
- Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology.
- Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes.
- Excellent oral and written communication skills, with the ability to convey messages concisely and effectively in both local and remote settings.
- Strong collaboration and communication skills (verbal and written).
- Self‑driven, adaptable, and capable of managing multiple projects.
- Proven ability to take calculated risks and execute novel solutions.
- Recognized as a mentor, team player, and technical expert with the ability to solicit feedback, accept input, and analyze success or failure.
Preferred Skills
- Understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.
- Strong interest in data science, modeling, and a drive to use or adopt AI to optimize workflows.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.