Staff Engineer, Operations — Wire Bonding & Process Improvement

Kulicke & Soffa; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading semiconductor solutions provider in Singapore is seeking a Manufacturing Engineer to manage production build processes and spearhead continuous improvement initiatives. The role requires a degree in engineering and 5-7 years of experience in semiconductor wire bonder manufacturing. Responsibilities include maintaining production software tools, coordinating with engineering for design improvements, and enhancing manufacturing yield and productivity through data-driven decisions. Ideal candidates will possess strong analytical skills and proficiency in statistical tools.

Qualifications

• 5-7 years of relevant experience in semiconductor wire bonder manufacturing.
• Strong understanding of bonding failure modes and defect analysis.
• Mechanical design & assembly process knowledge of wire bonding equipment.

Responsibilities

• Maintain and support the Production Software tools, Oracle and PCs.
• Spearhead continuous improvement projects to enhance yield and quality.
• Coordinate with design engineering to improve manufacturability.

Skills

Analytical skills

Problem-solving skills

Effective communication

Team-oriented

Education

Degree / Master in Engineering Disciplines (Mechanical / Mechatronics)

Tools

Statistical tools (JMP, Minitab)

Job description

A leading semiconductor solutions provider in Singapore is seeking a Manufacturing Engineer to manage production build processes and spearhead continuous improvement initiatives. The role requires a degree in engineering and 5-7 years of experience in semiconductor wire bonder manufacturing. Responsibilities include maintaining production software tools, coordinating with engineering for design improvements, and enhancing manufacturing yield and productivity through data-driven decisions. Ideal candidates will possess strong analytical skills and proficiency in statistical tools.