Simulation-driven Optical Packaging Research Engineer

National University of Singapore; Singapore; On-site; SGD 60,000 - 90,000; Part time

Job summary

The National University of Singapore (NUS) in Singapore seeks a Research Engineer to advance a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems, focusing on simulation and modeling. You will contribute to the design and validation of optical interfaces for FAU integration, using ANSYS Multiphysics and/or COMSOL Multiphysics with industry and academic collaboration.

Responsibilities include FAU geometry design, coupling scheme development, mechanical alignment, and

Qualifications

• Bachelor’s or Master’s degree in Electrical/ Electronics/ Mechanical Engineering or related field.
• Experience in simulation and modeling for optical, mechanical, thermal, thermo-optical, or thermo-mechanical systems.

Responsibilities

• Design FAU array geometry and optical coupling schemes (vertical and edge coupling).
• Model FAU mechanical alignment structures with kinematic constraints and evaluates adhesive stability.
• Simulate thermo-mechanical-optical effects and temperature-driven stress and drift in FAU systems.
• Collaborate on reports, publications, and presentations for academia and industry.

Skills

Simulation & modeling

Optical interconnects

Photonic packaging

FEM/ multiphysics

Technical writing

Education

Electrical Engineering, Electronics Engineering, Mechanical Engineering, Physics, Materials Science, Optical Engineering or equivalent

Tools

ANSYS Multiphysics

COMSOL Multiphysics

Zemax

Lumerical

Job description

The National University of Singapore (NUS) in Singapore seeks a Research Engineer to advance a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems, focusing on simulation and modeling. You will contribute to the design and validation of optical interfaces for FAU integration, using ANSYS Multiphysics and/or COMSOL Multiphysics with industry and academic collaboration.

Responsibilities include FAU geometry design, coupling scheme development, mechanical alignment, and