Research Fellow [Silicon Photonics and Packaging]

National University of Singapore; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

The National University of Singapore (NUS) Department of Electrical and Computer Engineering invites applications for a Research Fellow to lead in silicon photonics and packaging. The role involves close collaboration with researchers, students, and industry partners to derive insights from experiments and data.

You will work at the forefront of semiconductor photonics, contributing to innovation in optical coupling, packaging technologies and fabrication processes, with opportunities to publish

Qualifications

• Ph.D. or equivalent degree in Microelectronics, Electrical Electronics and Engineering, Information and Communication Technology, Science, Physics or equivalent is preferred.
• Experience in clean room fabrication, dry etch, wet etch, optical interconnects, fiber arrays, photonic packaging, semiconductor packaging, microelectronics, characterization, metrology, or reliability testing would be an advantage.
• Important simulation software: Zemax OpticsStudio, Ansys Lumerical or COMSOL Multiphysics.
• Advantageous software: 3D CAD tools, Klayout or L-Edit, MATLAB, Python, C language.
• Excellent communication skills and the ability to work effectively in a collaborative research environment.
• Self-motivated, able to work independently, and open to Fixed Term Contract.

Responsibilities

• Lead research and development on advanced optical coupling and packaging technologies for silicon photonics applications, including chip-to-chip and chip-to-fibre interconnections.
• Develop and standardize simulation workflows and modelling templates using optical and multiphysics tools (Zemax, Ansys Lumerical, COMSOL).
• Design and optimize optical coupling structures using Monte Carlo simulations and tolerance analysis.
• Develop fabrication processes for novel optical coupling structures with DfM and DfT principles.
• Design, develop and implement optical characterization and testing setups to evaluate coupling strategies.
• Supervise and mentor junior researchers and graduate students in research methods, simulation, fabrication and characterization.
• Manage data collection and large-scale analysis of optical datasets; conduct light cleanroom fabrication and device characterization.
• Prepare technical reports, publications and presentations for academic and industry audiences.
• Contribute to project planning, timelines and milestones; liaison with industry partners for impactful outcomes.

Skills

Communication

Analytical skills

Technical writing

Presentation skills

Team collaboration

Education

Ph.D. or equivalent in Microelectronics/EE/ICT/Science/Physics

Tools

Zemax OpticsStudio

Ansys Lumerical

COMSOL Multiphysics

3D CAD tools

Klayout/L-Edit

MATLAB

Python

C language

Job description

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Research Fellow [Silicon Photonics and Packaging]

University-Level Unit: College of Design and Engineering Faculty/Department-Level Unit: Electrical and Computer Engineering Employee Category: Research Staff Location: Kent Ridge Campus Posted On: 30/10/2026

Job Description

The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Fellow
to lead on the area of Silicon photonics and packaging.
You will work closely with our researchers, students, and professors, including industry collaborators to understand and derive insights from scientific experiments and data.
This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers

Responsibilities will involve:

1. Research & Development
a) Conduct research on advanced optical coupling and packaging technologies for silicon photonics applications, including chip-to-chip and chip-to-fibre optical interconnections.

b) Develop and standardize simulation workflows and modelling templates using optical and multiphysics simulation tools, such as Zemax OpticStudio, Ansys Lumerical, and COMSOL Multiphysics.

c) Design and optimize optical coupling structures using Monte Carlo simulations and tolerance analysis to evaluate alignment sensitivity, manufacturing variations, and coupling efficiency.

d) Develop and optimize fabrication processes for novel optical coupling structures, incorporating Design for Manufacturability (DfM) and Design for Testability (DfT) principles to ensure scalability, process robustness, and reliability.

e) Design, develop, and implement optical characterization and testing setups to evaluate emerging chip-to-chip and chip-to-fibre coupling strategies, including coupling efficiency, alignment tolerance, and optical performance.

f) Supervise and mentor junior researchers and graduate students, providing technical guidance on research methodologies, simulation, fabrication, characterization, and related research activities.

2. Data Analysis & Reporting

g) Manage the collection, preprocessing, and large-scale analysis of optical experimental and simulation datasets.

h) Light cleanroom fabrication duties and characterization of fabricated devices.

i) Validate, benchmark and report on various optical coupling schemes.

j) Prepare technical reports, publications, and presentations for both academic and industry audiences.

3. Project Management & Collaboration

k) Contribute to project planning, timelines, and milestones.

l) Take responsibility for delivering research milestones within project timelines.

m) Serve as the primary liaison with industry partners to align objectives and ensure impactful outcomes.

4. Innovation & Intellectual Property

n) Drive innovation in diagnostic methodologies and failure analysis workflows.

o) Contribute to patent filings, technology disclosures, and commercialization efforts.

p) Publish findings in high-impact journals and present at leading conferences.

Qualifications

• Ph.D. or equivalent degree in the field of Microelectronics, Electrical Electronics and Engineering, Information and Communication Technology, Science, Physics, or its equivalent from a reputable University/Institute is preferred, or equivalent related experience.
• Experience in clean room fabrication, dry etch, wet etch, optical interconnects, fiber arrays, photonic packaging, semiconductor packaging, microelectronics, characterization, metrology, or reliability testing would be an advantage.
• Important simulation software:
  • Zemax OpticsStudio
  • Ansys Lumerical or COMSOL
• Advantageous software:
  • 3D CAD tools
  • Klayout or L-Edit
  • General coding for data processing and scripting eg. MATLAB, C language and Python
• Excellent communication skills and the ability to work effectively in a collaborative research environment.
• Strong analytical, problem-solving, technical writing, and presentation skills.
• Self-motivated, able to work independently, and collaborate within a diverse team.
• Open to Fixed Term Contract.

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