Service & Application Engineer

ANRADUS PTE. LTD.; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

A semiconductor manufacturing company in Singapore seeks a Service & Application Engineer to provide technical support for project design and application. The ideal candidate will have at least 3 years of relevant experience, especially with wire bonders, and will handle customer requirements through technical discussions. This permanent role offers a salary package including basic salary, AWS, and a variable bonus, with occasional travel in the Asia Pacific region.

Qualifications

• At least 3 years of relevant experience with wire bonders and semiconductor assembly.
• Strong hands-on knowledge of semiconductor front-of-line equipment.

Responsibilities

• Provide technical support for project and application design proposals.
• Coordinate between sales/marketing and technical service teams to meet customer needs.
• Support pre-sales technical discussions and presentations.

Skills

Analytical problem-solving skills

Technical knowledge of front-of-line assembly

Ability to travel

Education

Diploma or Degree in Engineering

Job description

Overview

• Industry/ Organization Type: Manufacturing (Semiconductor)
• Position Title: Service & Application Engineer
• Working Location: Science Park
• Working Hours: 5 days (Mon – Fri, 8.30am – 5.30pm)
• Salary Package: Basic salary + AWS + Variable Bonus
• Duration: Permanent Role

Key Responsibilities

• Provide technical support for project and application design proposals.
• Apply analytical problem-solving skills; handle tight timelines and challenging issues.
• Join internal and external meetings to define specifications for project execution.
• Coordinate between sales/marketing and technical service teams to meet customer needs.
• Support pre-sales technical discussions and presentations; align on cost and time estimates.
• Maintain strong, hands-on knowledge of semiconductor front-of-line equipment, especially wire bonders (gold/copper/aluminium).

Qualifications

• Diploma or Degree in Engineering.
• At least 3 years of relevant experience, preferably with wire bonders and semiconductor assembly.
• Strong technical knowledge of front-of-line (FOL) assembly.
• Able to travel when required, occasionally within the Asia Pacific region.

Apply

Kindly apply through any of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to [e-mail]. Please indicate #79534 on the email subject.

Anradus Application Policy:

We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Rachael Lee | EA Reg No.: R2093131