Senior/Staff/Principal - Adv Pkg TD Integrator

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a Technology Development Process Integrator to develop advanced packaging solutions and ensure success for new process, new equipment, and new materials initiatives across advanced packaging products.

You will lead technology readiness and drive improvements in yield, quality, and reliability through process characterization and optimization. You will need strong understanding of frontend process integration with packaging requirements,

Qualifications

• PhD/Masters/Bachelor's in electrical & electronic, materials, mechanical engineering, physics or equivalent.
• 6+ years in semiconductor industry with frontend fab process integration or backend packaging experience.
• Experience with CPI, process reliability, and cross-functional collaboration.

Responsibilities

• Lead development and qualification of new packaging processes, materials and equipment.
• Drive process readiness, 1st pass yield, and production transition.
• Collaborate across functions to resolve process-related issues and improvements.

Skills

Project management

Communication

Presentation skills

Data analytics

Education

PhD

Masters

Bachelor's degree

Tools

Simulation tools

Data analytics platforms

Job description

As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron.

To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines& technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems.

Ensure smooth transition from new process development, 1st qualification success to small volume production launch

Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule

Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.

Qualify new process/technology/equipment/materials

Technical capability

Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations

To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process

Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.

Provide new solutions on time to meet company and customer needs

Define, develop and establish process capabilities, strategy and roadmap

To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

Job Requirements :

• PhD/Masters/bachelor's degree in electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• 6 years' and/or above experience in semiconductor industry
• Experience in Frontend fab Process integration or Module process
• Experience in Backend advance packaging wafer/ die level process or integration
• Understanding of silicon integration and how it interacts at backend process & package level through CPI
• Proficiency with simulation tools and data analytics platforms for performance analysis and optimization
• Experience in temporary/ permanent bonding technology (Wafer on wafer, Chip on wafer) is a plus
• Strong project management skills to ensure execution to timelines
• Strong communication and presentation skills
• Understanding of business needs and customers' requirement
• Ability to integrate & cooperate with people from cross function teams