Senior/Staff Engineer, Thermal Mechanical Simulation

stmicroelectronics asia pacific pte ltd; Singapore; On-site; SGD 100,000 - 160,000; Full time

Job summary

STMicroelectronics Singapore is seeking a Thermal-Mechanical Simulation Engineer to work with the R&D team on products that meet performance, manufacturability, and cost targets. You will perform FEA, CFD and multiphysics studies, identify potential issues early, and propose design improvements for robustness.

You will also support failure investigations and root cause analysis, collaborating with design and optical teams across locations and traveling as required.

Qualifications

• Bachelor’s, Master’s, or PhD in Mechanical Engineering with relevant modules.
• Strong knowledge of material science and solid mechanics.
• Experience in mold flow analysis and collaborative design environments.
• Strong documentation and presentation skills.

Responsibilities

• Perform finite element analysis (FEA), computational fluid dynamics (CFD) and multiphysics studies to identify design issues.
• Support failure investigation and root cause analysis using analysis tools.
• Collaborate with package design engineers, optical engineers, substrate designers and core teams to verify and implement improvements.
• Interact with stakeholders across multiple locations and travel as needed.

Skills

Finite element analysis

Thermal-mechanical analysis

Computational fluid dynamics

Multiphysics analysis

Material characterization

Python scripting

Strong written and verbal comms

Customer-facing environment

Mold flow analysis

Education

Bachelor’s/Master’s/PhD in Mechanical Engineering

Tools

SolidWorks

Job description

The Team

The Optical Product Packaging & Design team, based in Edinburgh and Singapore, is part of ST’s wider Imaging & Custom subgroup. The team designs and develops precision opto-mechanical assemblies incorporating ST silicon sensors to deliver advanced optical and photonic products.

The Role

As a Thermal-Mechanical Simulation Engineer, you will work closely with the R&D project team to develop products that meet performance, manufacturability, and cost objectives. Using advanced simulation tools, you will perform finite element analysis (FEA), computational fluid dynamics (CFD), and multiphysics studies to identify potential issues early in the development process and to recommend design improvements that enhance product performance and robustness.

You will also use analysis tools to support failure investigation and root cause analysis. In this role, you will collaborate with package design engineers, optical engineers, substrate designers, and core team members to ensure that proposed improvements are properly verified and implemented.

This position requires regular interaction with stakeholders across multiple geographic locations. The successful candidate must be comfortable working across different time zones and travelling at short notice where required.

Key Skills and Experience

Essential skills

• Finite element analysis
• Thermal-mechanical analysis
• Computational fluid dynamics
• Multiphysics analysis
• Material characterization
• Python scripting
• Strong written and verbal communication skills
• Ability to work effectively in a customer-facing environment

Knowledge and experience

• Bachelor’s, Master’s, or PhD in Mechanical Engineering, with relevant undergraduate modules
• Strong knowledge of material science
• Good understanding of solid mechanics, including static and dynamic behaviour
• Sound knowledge of thermal engineering and heat transfer
• Minimum 5 years of relevant experience
• Experience in mold flow analysis
• Experience in collaborative design environments
• Familiarity with FMEA
• CAD proficiency in SolidWorks
• Understanding of product design processes
• Strong documentation and presentation skills