Scientist/Senior Scientist, Advanced Packaging, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research is looking for a highly motivated Scientist / Senior Scientist to drive R&D in thermal management and cooling technologies. The role involves collaboration with diverse teams to innovate solutions for semiconductor packaging.

Successful candidates should have a PhD or master's degree and significant experience in thermal management. Key responsibilities include executing thermal engineering tasks, simulations, and new technology development.

Qualifications

• PhD or master’s degree in mechanical engineering, materials science, electrical engineering, or related fields.
• 2+ years’ work experience in thermal management for semiconductor packaging.
• Strong background in semiconductor package thermal design and electronics cooling.

Responsibilities

• Execute thermal engineering tasks for R&D projects and support project deliverables.
• Conduct thermal modelling and simulations using various tools.
• Support development of new cooling concepts and conduct proof-of-concept testing.
• Perform laboratory thermal measurements and correlate data with simulations.
• Collaborate with cross-functional teams and contribute to project documentation.

Skills

Thermal management

Heat dissipation

Fluid mechanics

CFD/thermal modeling

Experimental thermal characterization

Data analytics

Communication skills

Collaborative mindset

Education

PhD or master’s degree in related disciplines

Tools

ANSYS Icepak

ANSYS Fluent

COMSOL Multiphysics

SIEMENS Flotherm

Job description

About the Role

A*STAR Institute of Microelectronics (IME) is seeking a highly motivated Scientist / Senior Scientist to conduct R&D in thermal management, heat dissipation, and advanced cooling technologies for next-generation semiconductor packaging. The successful candidate will develop innovative thermal solutions for heterogeneous integration, AI/HPC packages, chiplets, 2.5D/3D integration, power electronics, and photonics applications.

Job Description

This role involves adopting advanced thermal/cooling concepts into package technologies through close collaboration with multidisciplinary teams in materials, packaging integration, reliability, simulation, and industry partners. The successful candidate focuses on practical execution of thermal R&D activities, including simulation, testing, data analysis, prototype evaluation, and implementation of innovative thermal solutions for next-generation packages such as AI/HPC, chiplet, 2.5D/3D integration, photonics, and power electronics.

Key Responsibilities

• Thermal Project Execution: Execute thermal engineering tasks for grant and/or customer-funded R&D projects, support project deliverables, timelines, experiments, and reporting; perform package thermal assessments and identify hotspot/cooling issues; generate technical data, reports, and presentation materials.
• Thermal Simulation & Analysis: Conduct thermal modelling using tools such as ANSYS Icepak, ANSYS Fluent, COMSOL Multiphysics, and SIEMENS Flotherm; perform steady-state and transient thermal simulations, junction temperature prediction, thermal resistance extraction, and thermal design optimization.
• New Cooling Technology Development: Support development and validation of new cooling concepts, including microchannel cooling, vapor chamber integration, immersion cooling and high-performance TIMs; build prototypes and conduct proof-of-concept testing.
• Thermal Characterization & Lab Work: Perform laboratory thermal measurements with IR thermography, thermocouple, thermal transient testing, and flow/pressure drop testing; correlate measured data with simulation results.
• Cross-functional Collaboration: Work with package design, process integration, materials, and reliability teams; support customer technical discussions and project reviews; contribute to publications, patents, and technical proposals.

Requirements

• PhD or master’s degree in mechanical engineering, materials science, electrical engineering, microelectronics, thermal sciences, or related disciplines.
• 2+ years’ work experience in thermal management for semiconductor packaging preferred.
• Strong background in semiconductor package thermal design, electronics cooling, CFD/thermal modeling, experimental thermal characterization, and materials for heat dissipation.
• Strong understanding of heat transfer, fluid mechanics, semiconductor packaging flows and AI/HPC package challenges.
• Experience in simulation tools and data analytics.
• Familiarity with JEDEC standards is advantageous.
• Strong communication and technical presentation skills.
• Strong industry engagement mindset.
• Collaborative and innovation-driven attitude.