Senior/Staff Engineer, Thermal Mechanical Simulation (13554)

STMICROELECTRONICS ASIA PACIFIC PTE LTD; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STMicroelectronics Asia Pacific Pte Ltd in Singapore is seeking a Thermal-Mechanical Simulation Engineer to work with the R&D team to deliver reliable, manufacturable, and cost-conscious designs through advanced simulation tools (FEA, CFD, and multiphysics).

You will analyze mold flow, support root cause investigations, and collaborate with package, optical, substrate, and core teams across time zones, with travel as needed.

Qualifications

• Experience performing finite element, thermal-mechanical and multiphysics simulations.
• Experience in mold flow analysis and collaborative design environments.
• Familiar with FMEA and strong documentation skills.
• SolidWorks CAD proficiency and good product design understanding.

Responsibilities

• Perform FEA, CFD, and multiphysics studies to identify issues early.
• Recommend design improvements to enhance performance and robustness.
• Support failure investigation and root cause analysis.
• Collaborate with package design, optical, substrate and core teams.
• Interact with stakeholders across multiple geographic locations/time zones.

Skills

Finite element analysis

Thermal-mechanical analysis

Computational fluid dynamics

Multiphysics analysis

Material characterization

Python scripting

Communication skills

Customer-facing

Education

Mechanical Engineering degree (Bachelors/Masters/PhD)

Tools

SolidWorks

Job description

The Team

The Optical Product Packaging & Design team, based in Edinburgh and Singapore, is part of ST’s wider Imaging & Custom subgroup. The team designs and develops precision opto-mechanical assemblies incorporating ST silicon sensors to deliver advanced optical and photonic products.

The Role

As a Thermal-Mechanical Simulation Engineer, you will work closely with the R&D project team to develop products that meet performance, manufacturability, and cost objectives. Using advanced simulation tools, you will perform finite element analysis (FEA), computational fluid dynamics (CFD), and multiphysics studies to identify potential issues early in the development process and to recommend design improvements that enhance product performance and robustness.

You will also use analysis tools to support failure investigation and root cause analysis. In this role, you will collaborate with package design engineers, optical engineers, substrate designers, and core team members to ensure that proposed improvements are properly verified and implemented.

This position requires regular interaction with stakeholders across multiple geographic locations. The successful candidate must be comfortable working across different time zones and travelling at short notice where required.

Key Skills and Experience

Essential skills

• Finite element analysis
• Thermal-mechanical analysis
• Computational fluid dynamics
• Multiphysics analysis
• Material characterization
• Python scripting
• Strong written and verbal communication skills
• Ability to work effectively in a customer-facing environment

Knowledge and experience

• Bachelor’s, Master’s, or PhD in Mechanical Engineering, with relevant undergraduate modules
• Strong knowledge of material science
• Good understanding of solid mechanics, including static and dynamic behaviour
• Sound knowledge of thermal engineering and heat transfer
• Minimum 5 years of relevant experience
• Experience in mold flow analysis
• Experience in collaborative design environments
• Familiarity with FMEA
• CAD proficiency in SolidWorks
• Understanding of product design processes
• Strong documentation and presentation skills