Senior Software Engineer, Global Payments & AI-Driven SDLC

Tencent; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Tencent is seeking a Senior Software Engineer to architect the bank integration layer of a high-scale payment network in Singapore. You will lead efforts to integrate AI-driven engineering into core workflows and own critical security handshakes protecting financial transactions.

Key responsibilities include designing resilient gateways, improving availability with distributed patterns, and mentoring junior engineers to elevate cross-border engineering standards.

Qualifications

• 5+ years in high-throughput banking/payments, fintech domain expertise.
• Deep knowledge of ISO 20022/SWIFT and FX lifecycle orchestration.
• Strong experience with Java & Spring Boot in distributed systems.
• Familiarity with OAuth2, Mutual TLS and secure design patterns.

Responsibilities

• Architect Global Connectivity: design high-availability gateways and standardize banking protocols into a scalable global network.
• Engineer Resilience: drive 99.99% availability with idempotency, circuit breakers and state machines.
• Innovate with AI: lead adoption of AI Agents to boost SDLC speed, testing, and reliability.
• Security & Integrity: own the security handshake architecture protecting global transactions.
• Technical Leadership: mentor juniors and raise cross-border engineering standards.

Skills

Java & Spring Boot

Kafka

RocketMQ

MySQL

ISO 20022/SWIFT

OAuth2

Mutual TLS

Digital signatures

AI Agents

Concurrency

Tools

Java

Spring Boot

Kafka

RocketMQ

MySQL

OAuth2

Mutual TLS

Digital Signatures

ISO 20022/SWIFT

AI Agents

Job description

Tencent is seeking a Senior Software Engineer to architect the bank integration layer of a high-scale payment network in Singapore. You will lead efforts to integrate AI-driven engineering into core workflows and own critical security handshakes protecting financial transactions.

Key responsibilities include designing resilient gateways, improving availability with distributed patterns, and mentoring junior engineers to elevate cross-border engineering standards.