Senior Silicon Photonics Test Engineer - Automation Leader

Lumilens

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+
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Job summary

Lumilens is seeking a Senior hands-on engineer to lead device and PIC characterization, build lab infrastructure, and mentor engineers. You will shape test strategies for EO, OE, OO at chip and wafer level and drive automation with LabVIEW and Python.

You will lead high-speed measurements, wafer probing, optical alignment, and root-cause analysis, collaborating with design and process teams to improve yield and transition R&D to production.

Qualifications

  • Bachelor’s degree or higher in EE, Physics, or related field.
  • Typically 8+ years of relevant experience.
  • Deep hands-on expertise in photonics device testing and optical lab work.
  • Experience with high-speed measurement equipment (VNA, oscilloscope, BERT).
  • Proficiency in LabVIEW and Python; test automation experience.

Responsibilities

  • Define and own the characterization strategy for devices and PICs (EO, OE, OO) at chip and wafer level.
  • Architect and lead high-speed measurements (bandwidth, BER, eye diagrams).
  • Establish and drive test automation frameworks and measurement routines.
  • Lead wafer probing, optical alignment, and test setup bring-up.
  • Drive root-cause analysis and resolution of complex test issues.
  • Mentor junior test engineers across the team.
  • Collaborate cross-functionally with design, process, and product teams to define test requirements and roadmaps.

Skills

Photonics device testing
Optical lab work
LabVIEW
Python
Wafer probing
Mentoring engineers

Education

Bachelor’s degree or higher in EE, Physics, or related field

Tools

VNA
Oscilloscope
BERT
LabVIEW
Python
VISA/SCPI

Job description

Lumilens is seeking a Senior hands-on engineer to lead device and PIC characterization, build lab infrastructure, and mentor engineers. You will shape test strategies for EO, OE, OO at chip and wafer level and drive automation with LabVIEW and Python.

You will lead high-speed measurements, wafer probing, optical alignment, and root-cause analysis, collaborating with design and process teams to improve yield and transition R&D to production.

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