Senior Silicon Photonics Engineer: High-Speed PICs & Impact

Lumilens; Singapore; On-site; SGD 120,000 - 180,000; Full time

Benefits offered by this job

Health insurance

Job summary

Lumilens is seeking an early-career engineer or PhD graduate to design and validate high-speed silicon photonic circuits. You will work on production-bound systems, not just simulations, contributing to modulators, photodetectors, and passive components across multi-domain simulations.

The role offers exposure to tapeout flows, PIC layout, and cross-disciplinary collaboration with electronics/packaging teams, with comprehensive learning and growth in a fast-moving environment.

Qualifications

• PhD in Electrical Engineering, Physics, or related field (silicon photonics or closely related area).
• 0–5 years of relevant experience (including fresh PhD graduates).
• Experience in design and simulation of silicon photonic devices or PICs.
• Strong understanding of guided-wave optics and device physics.
• Familiarity with tools such as Lumerical, COMSOL, or equivalent.

Responsibilities

• Design and optimize silicon photonic devices and circuits, including high-speed modulators, photodetectors, and passive components.
• Perform multi-domain simulations (EM, circuit, thermal) to meet bandwidth, loss and efficiency targets.
• Implement PIC layouts (GDS) using foundry PDKs and support tapeouts.
• Co-design with electronics and packaging teams for RF effects or thermal constraints.
• Support silicon bring-up and characterization by correlating measurements with simulations.
• Contribute to design libraries, modeling, and methodology development.

Skills

Silicon photonics

PIC design

Guided-wave optics

Device physics

Lumerical

COMSOL

Education

PhD in Electrical Engineering or related field

Tools

PDK

DRC/LVS

Job description

Lumilens is seeking an early-career engineer or PhD graduate to design and validate high-speed silicon photonic circuits. You will work on production-bound systems, not just simulations, contributing to modulators, photodetectors, and passive components across multi-domain simulations.

The role offers exposure to tapeout flows, PIC layout, and cross-disciplinary collaboration with electronics/packaging teams, with comprehensive learning and growth in a fast-moving environment.