Lead PECVD Process Engineer for Photonics & Packaging

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A research institute in Singapore is seeking a qualified candidate to develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) processes for advanced packaging and photonics applications. The ideal candidate will have at least 3 years of experience in semiconductor thin film modules, strong communication skills, and hands-on experience with characterization techniques. Responsibilities include troubleshooting film properties and preparing technical reports for stakeholders.

Qualifications

• 3+ years direct experience in semiconductor thin film module, preferably in PECVD module.
• Hands-on experience with basic process characterization techniques is advantageous.
• Good understanding of thin film property characterization is desired.

Responsibilities

• Develop and optimize PECVD process for Advanced Packaging and Photonics applications.
• Characterize thin film properties and troubleshoot process-related issues.
• Prepare and deliver technical reports and presentations.

Skills

Thin film deposition techniques

Statistical process control (SPC)

Design of Experiments (DOE)

Interpersonal and communication skills

Education

Bachelors/Masters in Materials Science

Electrical Engineering

Chemical Engineering

Physics

Chemistry

Microelectronics

Tools

DRSEM

HRTEM

Ellipsometry

Job description

A research institute in Singapore is seeking a qualified candidate to develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) processes for advanced packaging and photonics applications. The ideal candidate will have at least 3 years of experience in semiconductor thin film modules, strong communication skills, and hands-on experience with characterization techniques. Responsibilities include troubleshooting film properties and preparing technical reports for stakeholders.