Senior Research Engineer I (Power Electronics), IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 60,000 - 110,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research invites an experienced Device Module and Integration Engineer to drive SiC device process modules and integration flows in a fast-paced research environment.

You will develop bonding/debonding, PVD metallization, metal etching, CMP, BEOL and related processes; conduct experiments, analyze data, optimize device performance and yield, troubleshoot issues, collaborate with cross-functional teams, and document processes with SOPs to ensure

Qualifications

• 2–3 years of experience in semiconductor process/module integration.
• Knowledge of PVD, RIE/ICP etching, CMP, metallization, bonding/debonding and BEOL.
• Experience in SiC device fabrication is a plus.
• Familiarity with cleanroom protocols and semiconductor manufacturing processes.
• Strong problem-solving, communication and teamwork skills.
• Fab or semiconductor R&D experience is an advantage.

Responsibilities

• Develop and optimize SiC device process modules and integration flows.
• Develop processes for bonding/debonding, PVD metallization, metal etching, CMP, and BEOL
• Conduct experiments, analyze data, and optimize processes for device performance and yield.
• Troubleshoot process and integration issues and perform root-cause analysis.
• Collaborate with cross-functional teams for process development and integration.
• Document processes, maintain records, and prepare SOPs.

Skills

PVD

RIE/ICP etching

CMP

Metallization

Bonding/debonding

BEOL

SiC device fabrication

Education

Electronics Engineering / Materials Science / Physics degree

Job description

Job Description

We are seeking a highly skilled and experienced Device Module and Integration Engineer with expertise in semiconductor process modules such as bonding/debonding, PVD, metallization, CMP, and etching to join our dynamic team.

Job Description

We are seeking a highly skilled and experienced Device Module and Integration Engineer with expertise in semiconductor process modules such as bonding/debonding, PVD, metallization, CMP, and etching to join our dynamic team.

Responsibilities

• Develop and optimize SiC device process modules and integration flows.
• Develop processes for bonding/debonding, PVD metallization, metal etching, CMP, and BEOL
• Conduct experiments, analyze data, and optimize processes for device performance and yield.
• Troubleshoot process and integration issues and perform root-cause analysis.
• Collaborate with cross-functional teams for process development and integration.
• Document processes, maintain records, and prepare SOPs.

Requirements

• Diploma, Bachelor’s or Master’s in Electronics Engineering, Materials Science, Physics, or related field. 2–3 years of experience in semiconductor process/module integration.
• Knowledge of PVD, RIE/ICP etching, CMP, metallization, bonding/debonding, and BEOL processes.
• Experience in SiC device fabrication is a plus.
• Familiarity with cleanroom protocols and semiconductor manufacturing processes.
• Strong problem-solving, communication, and teamwork skills.
• Fab or semiconductor R&D experience will be an advantage.