Senior Quantum 3D Integration & Packaging Engineer

Applied Materials, Inc.; Singapore; Vor Ort; SGD 120.000 - 180.000; Vollzeit

Zusammenfassung

Applied Materials, Inc. in Singapore seeks a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies.

You will collect data, perform hardware characterization, and troubleshoot engineering issues while collaborating with vendors and customers. In the CTO group's quantum focus, you will help develop packaging solutions for emerging quantum devices, working with university and startup partners to advance state-of-the-art materials engineering.

Qualifikationen

• PhD/Master/Bachelor in relevant field required or closely related.
• 5+ years in advanced packaging, 3D integration, or semiconductor process development.
• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, and related tech.

Aufgaben

• Create 3D integration and packaging solutions for platforms and quantum structures.
• Collaborate with advanced packaging, process, hardware, and metrology teams to develop materials and processes.
• Design, collect data, and report on complex process engineering experiments within safety guidelines.
• Troubleshoot problems, perform root cause analysis, and resolve engineering issues.
• Generate internal and external documentation for products and reports.
• Design experiments, measure material and device properties, and interpret data.
• Stay updated on 3D integration, quantum information, and related fields to implement new tech.

Kenntnisse

Problem solving

Technical communication

Cross-functional collaboration

Data analysis

Process optimization

Root cause analysis

Ausbildung

PhD in Materials Science / Electrical Engineering / Physics / Microelectronics or related field

Master's degree in Materials Science / Electrical Engineering / Physics / Microelectronics or related field

Bachelor's degree in Materials Science / Electrical Engineering / Physics / Microelectronics or related field

Tools

Wafer-level packaging equipment

Hybrid bonding equipment

TSV tooling

Chiplet packaging tools

Jobbeschreibung

Applied Materials, Inc. in Singapore seeks a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies.

You will collect data, perform hardware characterization, and troubleshoot engineering issues while collaborating with vendors and customers. In the CTO group's quantum focus, you will help develop packaging solutions for emerging quantum devices, working with university and startup partners to advance state-of-the-art materials engineering.