Senior Process Engineer - Wafer Fab

MANPOWER STAFFING SERVICES (SINGAPORE) PTE LTD; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

MANPOWER STAFFING SERVICES (SINGAPORE) PTE LTD is seeking a Process Engineer to drive D2W hybrid bonding process optimization, yield improvement, and new process flow development. The role collaborates with internal Hybrid team, partners, and customers to deliver robust solutions.

You will conduct DOE studies, analyze experimental results, and translate findings into scalable processes for front-end wafer fabrication and related steps.

Qualifications

• DOE studies and data analysis to improve yield.
• Hands-on process development experience in C2W or W2W hybrid bonding.
• Strong ability to analyze and interpret process data and provide solutions.

Responsibilities

• Develop and optimize CIP processes to improve product yield.
• Conduct DOE experiments and process trials with data analysis.
• Define new process flows for customer products and run internal feasibility studies.
• Provide SME support in hybrid bonding process development and upstream/downstream flows.
• Prepare SOPs and technical documentation; publish best-known-methods.

Skills

DOE

Data analysis

Process optimization

Problem solving

Education

Master's in mechanical/electrical/electronics/physics or PhD

Tools

JMP

Matlab

Job description

The Process engineer plays a vital role in D2W hybrid bonding process optimization, yield improvement and to develop innovating process flow or path finding. PE Works closely between internal Hybrid team, partner and Customers.

• Responsible for process development & CIP’s to improve the product yield
• To conduct DOE’s and experimental process trails and data analysis
• Define new process flow for customer products and run internal feasibilities
• Provides technical subject matter expertise in the area process developments
• Understands the Hybrid bonding upstream & downstream process flow to relate actual Hybrid bonding or Fusion bonding yield related topics
• Process optimization and data analysis to improve the process responses hybrid bonding and annealing
• Supports SOP, technical documentation and product operating manual writing activities and publish BKM process flow
• Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team
• Machine and Technical Support
• Machine operation and application/product setup
• Prepares and executes customer demo feasibilities and recommend the process flow
• Coordinates and provides technical solutions / problems solving on customer process related issues in collaboration with Field issues
• Investigates process issues at customer site and supports Engineering team

Education

• Master's in mechanical/electrical/Electronics /Physics or PHD

Work experience

• Minimum 5 years relevant experience in C2W or W2W hybrid bonding and Front end wafer fab/backend process
• Significant practical experience in solving process issues and process optimizations including new process setup
• Hands-on experience in semiconductor front end or backend Process and equipment’s including defectivity & yield engineering

Expertise and methodology

• Good in MS-Office, data analysis SW like JMP, Matlab
• Hands-on Process Development Expertise and able to share the Problem Statement in crystal clear

EA License : 02C3423

EA Personnel : R22108699