Senior/Principal Process Integration Engineer for NAND Flash

Brightecs Innovation Pte Ltd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Brightecs Innovation Pte Ltd in Singapore seeks a senior engineer to lead the architecture design of 3D NAND devices, including memory cells and peripheral circuits. You will drive DoE studies, analyze reliability, and collaborate with process development to iterate device technology.

The role requires deep knowledge of 3D NAND physics and failure mechanisms, with a track record of improving device performance or yield through troubleshooting and cross-functional teamwork.

Qualifications

• Master's degree or higher in a relevant field.
• 8+ years of semiconductor device experience, including 3+ years in 3D NAND.
• In-depth knowledge of 3D NAND device physics, failure modes and reliability.
• Experience in improving device performance or yield through troubleshooting.

Responsibilities

• Lead the architecture design for 3D NAND devices (memory cells, select transistors, and peripheral devices).
• Design and execute DoE, analyze process variation impact on device performance and reliability.
• Collaborate with the process development team to assess new device architectures and drive technology iteration.
• Write detailed technical reports and support customers or internal teams in resolving related technical issues.

Skills

Troubleshooting

Cross-team communication

Problem solving

Education

Master's degree or above in Microelectronics/Physics/Materials Science & Engineering/Chemistry

Job description

• Lead the architecture design (e.g. memory cells, select transistors, and peripheral devices), process integration, electrical characterization, modeling and simulation, failure analysis for 3D NAND devices.
• Design and execute DoE, analyze the impact of process variations on device performance and reliability (such as durability and data retention), and propose improvement solutions.
• Collaborate with the process development team to assess new device architectures, driving technology iteration.
• Write detailed technical reports and support customers or internal teams in resolving related technical issues.

Required Qualifications:

• Education: Master's degree or above
• Major: Microelectronics, physics, material science & engineering, chemistry;
• Other Requirements:
• 8+ years of semiconductor device work experience, 3+ years of 3D NAND work experience.
• In-depth knowledge of 3D NAND device physics, familiar with its principles, failure modes, and reliability mechanisms.
• Troubleshooting, and problem-solving capabilities, with experience in successfully improving device performance or yield.
• Familiar with advanced semiconductor manufacturing processes and integration flows.
• Strong cross-team communication and collaboration skills.