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ASM in Singapore is seeking an experienced engineer to join our Advanced Packaging R&D team. You will lead development and optimization of ALD processes for next‑generation semiconductor applications, translating complex challenges into manufacturable solutions with hands‑on experimentation.
You will collaborate closely with cross‑functional and customer teams to demonstrate and transfer technologies into high‑volume production, contributing to innovation in 5G, cloud, and AI hardware.
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Job mission As a key member of our Advanced Packaging R&D team, you will lead the development and optimization of advanced Atomic Layer Deposition (ALD) processes for next-generation semiconductor applications. Combining deep technical expertise with hands-on experimentation, you will translate complex process challenges into innovative, manufacturable solutions and work closely with cross-functional and customer teams to successfully demonstrate and transfer technologies into high-volume…
Engineering job in Singapore, SG