Senior Principal Mechanical Engineer, Advanced Packaging

ASM; Singapore; Vor Ort; SGD 70.000 - 110.000; Vollzeit

Zusammenfassung

ASM Singapore is inviting engineers of various experience levels to join the Advanced Packaging team. You will design and develop semiconductor equipment, contribute to system-level troubleshooting, and support NPI from early builds through ramp to high-volume manufacturing.

This role offers hands-on challenges, collaboration with global teams, and travel opportunities (~25–50%), with a clear path for growth within a diverse, innovation-driven culture.

Qualifikationen

• Experience in semiconductor equipment or complex technical environments.
• Knowledge of CE, NFPA, Semi S2‑95, and other relevant standards for semiconductor manufacturing equipment.
• Strong problem-solving mindset with system-level thinking.
• Analytical skills (DOE, data analysis, structured problem solving).
• Comfortable working across global teams and time zones.
• Strong communication skills, including customer-facing interactions.
• Willingness to travel internationally (~25–50%).

Aufgaben

• Design and develop semiconductor equipment within ASM’s Advanced Packaging team.
• Contribute to system-level troubleshooting and equipment performance improvements.
• Support new product introduction (NPI) from early builds to ramp to high-volume manufacturing.
• Lead or support first-in-fab deployments — installation, start-up, qualification.
• Translate field feedback into design and reliability improvements.

Kenntnisse

Semiconductor equipment knowledge

Problem solving

Strong communication skills

Willingness to travel

Ausbildung

Bachelor’s degree in Engineering

Master’s degree in Engineering

PhD in Engineering

Jobbeschreibung

ASM Singapore is inviting engineers of various experience levels to join the Advanced Packaging team. You will design and develop semiconductor equipment, contribute to system-level troubleshooting, and support NPI from early builds through ramp to high-volume manufacturing.

This role offers hands-on challenges, collaboration with global teams, and travel opportunities (~25–50%), with a clear path for growth within a diverse, innovation-driven culture.