Senior Packaging Engineer, Advanced Back-End Ops (FAB)

A*STAR - Agency for Science, Technology and Research

Singapore

On-site

SGD 60,000 - 80,000

Full time

14 days+

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Job summary

A*STAR - Agency for Science, Technology and Research is seeking a Packaging & Testing Engineer to support semiconductor research. In this role, you will bridge advanced packaging processes and manufacturing practices, focusing on operational control in back-end processes such as wafer backgrinding and molding.

The ideal candidate will have a relevant degree and 3–5 years of experience in semiconductor packaging, strong analytical skills, and proficiency in data analysis tools. Join us to enable manufacturing through advanced packaging integration.

Qualifications

  • Bachelor’s degree or higher in Mechanical Engineering, Materials Science, Electrical Engineering or related disciplines.
  • 3–5 years of experience in semiconductor packaging and/or testing with hands-on exposure.
  • Strong understanding of back-end fundamentals: wafer thinning, die singulation, encapsulation.

Responsibilities

  • Own day-to-day operational engineering control of back-end processes, including dicing and molding.
  • Support electrical test operations to validate package performance.
  • Enable research-to-manufacturing transition ensuring scalable processes.

Skills

Data analysis
Yield analysis
Process control
Reliability testing

Education

Bachelor’s degree in Mechanical Engineering

Tools

JMP
Python
Excel

Job description

A*STAR - Agency for Science, Technology and Research is seeking a Packaging & Testing Engineer to support semiconductor research. In this role, you will bridge advanced packaging processes and manufacturing practices, focusing on operational control in back-end processes such as wafer backgrinding and molding.

The ideal candidate will have a relevant degree and 3–5 years of experience in semiconductor packaging, strong analytical skills, and proficiency in data analysis tools. Join us to enable manufacturing through advanced packaging integration.

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