Senior Manager, AI & HBM Systems – Global Enablement

Micron Technology, Inc.; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Senior Manager for HBM Customer Integration and System Engineering.

You will lead teams overseeing customer integration, technical engagement, and system engineering, coordinating with design, product, manufacturing, and system groups to convert customer requirements into scalable product solutions. The role demands deep expertise in HBM architectures, packaging, and manufacturing, with a track record in global leadership and executive

Qualifications

• BS or MS in Electrical/Computer Engineering or related field.
• 10+ years in semiconductor engineering, system integration, or engineering leadership.
• Strong knowledge of HBM architecture and packaging, manufacturing processes, and customer qualification.

Responsibilities

• Lead and develop teams for customer integration, technical engagement, and system engineering.
• Drive customer interlocks, design reviews, escalations, and integration activities.
• Partner with design, product, manufacturing, and system engineering to translate customer requirements into solutions.
• Provide leadership in HBM architecture, system integration, packaging, and manufacturing.
• Establish scalable engagement models, governance, and executive communications for customer deployment.
• Drive resolution of complex technical issues and influence future roadmaps.
• Develop and deploy AI systems to automate processes and solve challenges.

Skills

Technical leadership

Cross-functional collaboration

Customer engagement

Communication

AI systems

Education

BS in Electrical Engineering

MS in Electrical Engineering

Job description

Micron Technology, Inc. in Singapore is seeking a Senior Manager for HBM Customer Integration and System Engineering.

You will lead teams overseeing customer integration, technical engagement, and system engineering, coordinating with design, product, manufacturing, and system groups to convert customer requirements into scalable product solutions. The role demands deep expertise in HBM architectures, packaging, and manufacturing, with a track record in global leadership and executive