HBM Product Integration Lead: System-Level Innovation

Micron Technology, Inc.

Singapore

On-site

SGD 180,000 - 240,000

Full time

14 days+

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Job summary

Micron Technology, Inc. is seeking a Product Integration Lead for the HIG HBM Product Development Team in Singapore.

You will drive silicon-system alignment, manage change initiatives, and coordinate across Architecture, Product, Systems Engineering, Packaging, and Quality to meet evolving customer demands with agility. Your role emphasizes blending HBM and system capabilities, overseeing risk assessments, and leveraging AI to streamline workflows and enable data-driven decisions across projects

Qualifications

8+ years of demonstrated ability in Product, Design, Process, Yield Enhancement, or related engineering fields.
Experience with product development projects is preferred.
Programming skills in Python/Java/C/VB.
Tableau and PowerBI development experience is a plus.

Responsibilities

Manage technical inputs and drive silicon-system alignment on requirements and commitments using the SCD.
Collaborate with HBM Architecture, Product and Systems Engineering, BU, Technology Development, Packaging, and Global Quality to align system specs.
Understand sample usage and gaps in capability; manage sample delivery with development timelines.
Lead Triage Team for System or Chip Feature Interaction to clarify ownership and mitigations.
Manage Qualification Definition and Changes; drive Change Control Board for late/post qual changes.
Communicate priorities within HBM Development to maintain focus on system specs and address concerns.