Senior Infrastructure Lead & Platform Architect

BOND FINANCIAL GROUP PTE. LTD.; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

BOND FINANCIAL GROUP PTE. LTD. is seeking an Infrastructure Lead to own the infrastructure strategy, architecture, and roadmap.

Lead the team with hands-on capability to ensure platform reliability, security, cost-efficiency, and business continuity in a DevSecOps environment. Responsibilities include governance, provisioning, and operating the infrastructure stack, plus incident response and DR testing in line with ISO 27001:2022.

Qualifications

• 10+ years hands-on infrastructure or platform engineering experience with 3+ years in a leadership role.
• Proven experience managing production infrastructure including 24x7 on-call incident response and DR execution.
• Demonstrated experience designing and delivering DR and BCP programmes.
• Experience managing third-party infrastructure or managed service providers; ISO 27001:2022 frameworks exposure.

Responsibilities

• Own and drive the infrastructure strategy, platform decisions, and technology roadmap in alignment with organisational objectives.
• Govern infrastructure costs, capacity planning, and IaC change controls across all environments.
• Build and configure cloud infrastructure using IaC tooling; manage networking, secrets, and certificate lifecycle across all environments.

Skills

Leadership

Cloud architecture

DevSecOps

Kubernetes

DR/BCP planning

Cost governance

Education

Bachelor's degree in Computer Science / IT / Engineering

Tools

Terraform

AWS

Azure

GCP

Job description

BOND FINANCIAL GROUP PTE. LTD. is seeking an Infrastructure Lead to own the infrastructure strategy, architecture, and roadmap.

Lead the team with hands-on capability to ensure platform reliability, security, cost-efficiency, and business continuity in a DevSecOps environment. Responsibilities include governance, provisioning, and operating the infrastructure stack, plus incident response and DR testing in line with ISO 27001:2022.