Senior HBM Electrical Failure Analysis Engineer

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Technology, Inc. is seeking a Senior HBM Electrical Failure Analysis Engineer to drive electrical characterization and failure analysis of HBM products within the DEMQRA team.

You will distinguish between package and device-related failures and use tools like uMate, Merlin, and Prober to perform detailed characterization. The role requires strong troubleshooting, deep DRAM/process knowledge, and the ability to communicate results across engineering groups.

Qualifications

• Bachelor’s degree in Electrical / Electronics / Computer Engineering
• 5+ years in semiconductor field
• Knowledge of DRAM operation, fabrication process and semiconductor device physics
• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing and module testing concepts
• Unix, Cadence, and/or uMate familiarity

Responsibilities

• Interpret historical test results
• Perform electrical failure analysis and categorize failures on HBM products
• Document failed conditions and test results
• Coordinate with PYE/CSAM/FO/PFA and Product Engineering for analysis
• Communicate results and provide data interpretation
• Assist lab users with equipment setup and data interpretation

Skills

Troubleshooting

Analytical thinking

Written & verbal communication

Independent work & teamwork

Strong attention to detail

Education

Bachelor’s degree in Electrical / Electronics / Computer Engineering

Master’s degree (desired) in Electrical / Electronics / Computer Engineering

Tools

uMate tester

Merlin

Mongoose SM3

Prober

Cadence/DFII

Job description

Micron Technology, Inc. is seeking a Senior HBM Electrical Failure Analysis Engineer to drive electrical characterization and failure analysis of HBM products within the DEMQRA team.

You will distinguish between package and device-related failures and use tools like uMate, Merlin, and Prober to perform detailed characterization. The role requires strong troubleshooting, deep DRAM/process knowledge, and the ability to communicate results across engineering groups.