Senior Engineer, HBM Reliability & Test Engineering

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 150,000 - 190,000; Full time

Job summary

Micron Technology, Inc. is seeking a senior leader in HBM reliability engineering to spearhead a high-performing team responsible for reliability test development and execution for the latest HBM products, including DRAM interfaces and stacked variants.

You will drive extrinsic DPM reduction and intrinsic reliability improvements while optimizing manufacturing test flow to meet KPI targets for quality, cost, and cycle time.

Qualifications

• Bachelor's or Master's in Electrical and Electronics Engineering.
• 3 years of semiconductor industry experience.
• Product engineering experience preferred.
• Strong leadership and problem-solving with root-cause analysis.
• Proficient in statistics, data analysis, and scripting.
• Excellent communication and presentation skills.
• Willingness to travel internationally.

Responsibilities

• Develop reliability test flows and plans covering product reliability aspects.
• Drive DPM reduction (Time 0 and field) and intrinsic reliability improvements.
• Lead cross-functional collaboration with Fab, TD, GQ and other teams.
• Mentor and develop team members; manage projects for timely delivery.
• Promote AI-first mindset and embed automation in reliability workflows.

Skills

Leadership

Problem solving

Statistics

Data analysis

Scripting

Communication skills

Team collaboration

Electrical & Electronics Eng

Education

Electrical and Electronics Engineering degree

Tools

Python

MATLAB

Job description

Micron Technology, Inc. is seeking a senior leader in HBM reliability engineering to spearhead a high-performing team responsible for reliability test development and execution for the latest HBM products, including DRAM interfaces and stacked variants.

You will drive extrinsic DPM reduction and intrinsic reliability improvements while optimizing manufacturing test flow to meet KPI targets for quality, cost, and cycle time.