Senior/Staff Quality and Reliability Assurance Engineer - High Bandwidth Memory

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is seeking a Senior/Staff Product Quality and Reliability Assurance Engineer to support the reliability qualification and quality monitoring of High Bandwidth Memory products. You will work with multi-functional teams to ensure reliability standards are met.

The ideal candidate has over 5 years of semiconductor experience, a Bachelor's degree in Electrical/Electronics/Computer Engineering, and strong troubleshooting skills. Familiarity with programming and statistical tools is preferred.

Qualifications

• 5+ years of experience in the semiconductor field.
• Knowledge of DRAM operation, fabrication process, and device physics.
• Familiarity with advanced packaging and testing concepts.

Responsibilities

• Conduct New Product Qualifications.
• Define product qualification requirements.
• Perform risk assessments during qualification cycles.

Skills

Semiconductor experience

Troubleshooting skills

Organizational skills

Communication skills

Statistical analysis using JMP

Programming (Perl, C++, Python, HTML, CGI, Java)

Education

Bachelor's degree in Electrical / Electronics / Computer Engineering

Master’s degree in Electrical / Electronics / Computer Engineering

Tools

DFII/Cadence

Auto Test Equipment (ATE)

Job description

Job Description

As a Senior/Staff Product Quality and Reliability Assurance Engineer (PQRA), you will support reliability qualification and quality monitoring of High Bandwidth Memory products (HBM), help develop product reliability methodologies, and respond to product deviations as they pertain to quality and reliability. You will establish and implement requirements, specifications and metrics such as Defects per Million (DPM), Failure in Time (FIT), and Lifetime. In this role, you will work with multi‑functional engineering teams to ensure product reliability methods are established and followed, perform risk assessments, and provide support for manufacturing teams regarding reliability issues. In this dynamic role, you will have opportunities to gain new product knowledge on an ongoing basis.

Responsibilities

• Conduct New Product Qualifications
• Define High Bandwidth Memory (HBM) qualification requirements
• Comprehend failures and failure rate within the scope of the qualification
• Perform risk assessment at all decision points within the qualification cycle
• Review qualification data and sign off that qualification requirements have been met
• Issue internal product release notifications for qualification
• Develop product reliability methodology, monitors, metrics, and specifications
• Cooperatively develop and establish reliability targets and standards with technology development and product engineering teams
• Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues
• Develop and improve product reliability tests to assess new HBM failure mechanisms
• Coordinate and drive vital specification improvements for existing products
• Review internal quality metrics and drive customer DPM to BIC
• Establish and implement quality requirements
• Establish and review ongoing product quality metrics
• Assess deviations for product quality and reliability risks; data mining and correlation of all inline test data; root cause finding and drive CA/PA; define evaluation necessary to mitigate risks; review and support process excursion analysis
• Communicate violations to defined release/acceptance criteria
• Communicate issues and corrective actions across all Micron products
• Provide internal technical support for customer support teams
• Assist RMA team with detailed analysis of returned material
• Investigate manufacturing history and identify issues related to customer failure signature
• Perform additional data collection as needed and per customer request
• Develop reliability process monitor (RPM) plans
• Assist with necessary corrective actions at the manufacturing level
• Comprehend field failure rates relative to internal failure rates

Qualifications

• 5+ years of experience in the semiconductor field
• Knowledge of DRAM operation, fabrication process, and semiconductor device physics
• Familiarity with advanced packaging, wafer testing, component testing, and module testing concepts and flow
• Strong troubleshooting skills
• Good organizational skills and sharp attention to detail
• Good written and oral communication skills
• Ability to work independently or in a group environment
• Knowledge of using statistical analysis like JMP
• Familiarity with Unix, DFII/Cadence, and/or Auto Test Equipment (ATE)
• Familiarity with Perl, C++, Python, HTML, CGI, or Java
• Engineering experience in one of the following areas preferred: Product Engineering, Product Quality and Reliability Process Integration, Product Yield Enhancement

Education

Required: Bachelor's degree in Electrical / Electronics / Computer Engineering. Desired: Master’s degree in Electrical / Electronics / Computer Engineering.

Equal Employment Opportunity Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.