Senior FR4/PCB Process Engineer for Photonics

Lumilens; Singapore; On-site; SGD 150,000 - 190,000; Full time

Benefits offered by this job

Competitive compensation

Comprehensive health coverage

Job summary

Lumilens is seeking a hands-on Component Process Engineer to bridge hardware design teams, packaging manufacturing, and global substrate suppliers. Focus on FR4 substrate/PCB development, from new tech to supplier qualification, leveraging mSAP and HDI processes for high-speed optical transceivers.

This role requires deep materials/mechanical knowledge, problem solving, and cross-functional execution at a global scale, with 30–50% travel in Asia.

Qualifications

• B.S. or M.S. in Material, Chemistry or Mechanical Engineering.
• 8+ years in FR4 substrate/PCB development or manufacturing.
• Knowledge of mSAP and Any-Layer HDI processes for high-speed optics.

Responsibilities

• Identify and qualify FR4/PCB substrate suppliers worldwide.
• Lead DFM/DFT/DFR for PCB substrates with risk analysis.
• Oversee FR4/PCB quality control, failure analyses, reliability tests.
• Collaborate with packaging teams during SMT, die attach, wire bond, alignment and testing.

Skills

DFM/DFT/DFR

PCB testing

English fluency

Education

B.S./M.S. in Material, Chemistry or Mechanical Engineering

Tools

Cadence

SolidWorks

JMP

Job description

Lumilens is seeking a hands-on Component Process Engineer to bridge hardware design teams, packaging manufacturing, and global substrate suppliers. Focus on FR4 substrate/PCB development, from new tech to supplier qualification, leveraging mSAP and HDI processes for high-speed optical transceivers.

This role requires deep materials/mechanical knowledge, problem solving, and cross-functional execution at a global scale, with 30–50% travel in Asia.