Senior Flip-Chip Process Engineer for Photonics

Lumilens; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Lumilens is building photonics infrastructure for AI supercomputing. We are seeking a seasoned process engineer to own the Flip Chip process for silicon photonic wafers, collaborating with OSAT or internal lines to optimize yield and reliability.

The role focuses on DOE-driven process characterization, materials qualification, and robust SPC controls, with a strong emphasis on preventing defects and ensuring long-term process stability across manufacturing stages.

Qualifications

• Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or equivalent.
• Experience: 5+ years in flip chip assembly.
• Knowledge: plasma cleaning, flux engineering, pick & place, reflow, underfill, curing, TCB/NCP flux-less flow.
• FMEA, SPC controls, 8D problem-solving.
• Finite element simulations for warpage and thermal dissipation.

Responsibilities

• Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line.
• DOE to characterize process window and margin; optimize process integration to increase yield and manufacturability.
• Material characterization & selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.
• Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
• Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.
• Manage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.
• Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.

Skills

Flip chip assembly

Materials science background

Finite element simulation

Problem-solving (8D)

Process optimization

Education

Bachelor or Master in Materials Science / Chemical Engineering / Mechanical Engineering / Microelectronics

Tools

JMP

Minitab

Job description

Lumilens is building photonics infrastructure for AI supercomputing. We are seeking a seasoned process engineer to own the Flip Chip process for silicon photonic wafers, collaborating with OSAT or internal lines to optimize yield and reliability.

The role focuses on DOE-driven process characterization, materials qualification, and robust SPC controls, with a strong emphasis on preventing defects and ensuring long-term process stability across manufacturing stages.