Senior Equipment Engineer — Yield & OEE Optimizer

STATS CHIPPAC PTE. LTD.

Singapore

On-site

SGD 70,000 - 110,000

Full time

14 days+

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Job summary

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes.

Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide. STATS ChipPAC is seeking a supervisory engineer to manage AEs, sustain equipment performance,

Qualifications

Diploma in Mechanical Engineering required.
3–5 years of relevant wafer bumping experience in backend operations.

Responsibilities

Plan training program on new incoming line sustaining AE on the job function on set-up, conversion and equipment repair to support production loading.
Plan and develop machine parts stock to minimize downtime while awaiting parts delivery.
Review the OEE, machine utilization and FDC regularly to seek improvement on equipment.
Develop innovative solutions to problems with initiative and independent thinking.
Coordinate with external vendors to resolve line issues and drive improvements.
Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
Oversee ball drop, reflow, taping, detaping, wafer mounter, saw singulation and wafer probing testing.
Experience in backend assembly process is preferred.