Senior / Equipment Engineer

STATS CHIPPAC PTE. LTD.; Singapore; Presencial; SGD 70 000 - 110 000; Tempo integral

Resumo da oferta

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes.

Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide. STATS ChipPAC is seeking a supervisory engineer to manage AEs, sustain equipment performance,

Qualificações

• Diploma in Mechanical Engineering required.
• 3–5 years of relevant wafer bumping experience in backend operations.

Responsabilidades

• Plan training program on new incoming line sustaining AE on the job function on set-up, conversion and equipment repair to support production loading.
• Plan and develop machine parts stock to minimize downtime while awaiting parts delivery.
• Review the OEE, machine utilization and FDC regularly to seek improvement on equipment.
• Develop innovative solutions to problems with initiative and independent thinking.
• Coordinate with external vendors to resolve line issues and drive improvements.
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
• Oversee ball drop, reflow, taping, detaping, wafer mounter, saw singulation and wafer probing testing.
• Experience in backend assembly process is preferred.

Conhecimentos

OEE analysis

Equipment troubleshooting

Vendor coordination

Problem solving

Training development

Formação académica

Diploma in Mechanical Engineering

Descrição da oferta de emprego

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

Manage AEs, sustain equipment performance, improve OEE, resolve line/quality issues, and drive yield, productivity and cost improvements.

Key responsibilities

• Plan training program on new incoming line sustaining AE on the job function on set-up, conversion and equipment repair to support production loading.

• Plan and develop machine parts stock available to minimize downtime on awaiting for parts delivery.

• Review the OEE, machine utilization and FDC regularly to seek improvement on equipment.

• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.

• Communicate with external vendors to resolve problems as line encounter and work on improvement.

• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.

• In-charge of ball drop, reflow, taping, detaping, wafer mounter, saw singulation process and open short and wafer probing testing.

• Experience in backend assembly process is preferred.

What we're looking for

• Diploma in Mechanical Engineering or equivalent.

• Minimum with 3 – 5 years of relevant experience in wafer bumping for backend operations.