Senior / Equipment Engineer ( Semiconductor )

RecruitPedia Pte Ltd; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

RecruitPedia Pte Ltd is seeking an experienced Equipment Engineer to lead and support backend semiconductor assembly activities, aiming to sustain manufacturing operations and optimize OEE. You will mentor assistants, manage spare parts, and drive continuous improvement in yield and productivity.

The role requires a diploma in a relevant field and 3–5 years of hands-on semiconductor experience, with strong troubleshooting and process optimization knowledge.

Qualifications

• Diploma in Mechanical Engineering, Mechatronics, Manufacturing Engineering or related discipline.
• 3–5 years hands-on experience in semiconductor backend assembly or wafer bumping operations.
• Strong knowledge of backend assembly processes, troubleshooting, and optimization.
• Experience in yield improvement, OEE enhancement, and production support.
• Ability to work independently and collaborate with cross-functional teams and vendors.

Responsibilities

• Lead and support equipment engineering to sustain manufacturing operations and improve OEE.
• Train and mentor Assistant Engineers on setup, conversion, troubleshooting, repair, and maintenance.
• Develop and maintain spare parts inventory strategies to minimize downtime.
• Monitor OEE, machine utilization, and FDC data to identify improvement opportunities.
• Investigate issues and implement solutions to enhance reliability and performance.
• Coordinate with suppliers and vendors to resolve technical issues and drive equipment enhancements.
• Own backend assembly processes including ball drop, reflow, taping/detaping, wafer mounting, saw singulation, probing.

Skills

Equipment troubleshooting

Process optimization

Mentor/training

Cross-functional collaboration

Education

Diploma in Mechanical Engineering, Mechatronics, Manufacturing Engineering

Tools

Reflow equipment

Wafer mounting

Saw singulation

Probing equipment

Taping/detaping

Job description

About the Role

Lead and support equipment engineering activities to sustain manufacturing operations, optimize equipment performance, improve Overall Equipment Effectiveness (OEE), resolve production and quality issues, and drive continuous improvements in yield, productivity, and cost efficiency.

Key Responsibilities

• Train and mentor Assistant Engineers (AEs) on equipment setup, conversion, troubleshooting, repair, and maintenance activities to support production demands.
• Develop and maintain spare parts inventory strategies to minimize equipment downtime and ensure operational continuity.
• Monitor and analyze OEE, machine utilization, and Fault Detection & Classification (FDC) data to identify opportunities for equipment improvement.
• Investigate equipment-related issues and implement innovative solutions to enhance reliability and performance.
• Liaise with equipment suppliers and external vendors to resolve technical issues and drive equipment enhancement initiatives.
• Identify yield, quality, and productivity improvement opportunities, and implement corrective and preventive actions to reduce manufacturing costs.
• Take ownership of backend assembly processes, including ball drop, reflow, taping/detaping, wafer mounting, saw singulation, open/short testing, and wafer probing operations.
• Support continuous improvement projects to enhance manufacturing efficiency and product quality.

Requirements

• Diploma in Mechanical Engineering, Mechatronics, Manufacturing Engineering, or a related discipline.
• Minimum 3 to 5 years of hands-on experience in semiconductor backend assembly or wafer bumping operations.
• Strong knowledge of backend assembly processes, equipment troubleshooting, and process optimization.
• Experience in yield improvement, OEE enhancement, and production support within a manufacturing environment.
• Ability to work independently and collaborate effectively with cross-functional teams and external vendors.
• Knowledge of reflow, wafer mount, saw singulation, probing, taping/detaping, and related semiconductor assembly equipment will be advantageous.

We regret that only shortlisted candidate will be notified.