Senior Engineer, Process Integration, NAND, NTI

Micron Technology; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Senior/Principal NAND Module Process Integration Engineer to design, develop, integrate, and implement innovative process solutions for next-generation 3D NAND yield and quality with competitive cost and performance.

You will lead cross-functional teams, develop CSPEC criteria, coordinate site activities, and drive AI-enabled improvements across PI modules to support transfer to manufacturing.

Qualifications

• BS, MS or PhD in Electrical Engineering, Microelectronics, Chemical Engineering or related field.
• Minimum of 3 years of experience in semiconductor Process Integration and Yield Enhancement.
• Proficiency in scripting/programming/BI analytics software such as Python, SolidWorks, Tableau, Power BI, etc.

Responsibilities

• Identify and quantify module deficiencies and technology gaps; lead cross-functional teams to address issues and improve process flows.
• Develop or redefine CSPEC criteria for optimal product performance and drive capability.
• Coordinate activities to secure funding for experiments, conversions, and communicate decisions across R&D and Manufacturing partners.
• Lead development projects to evaluate new integration schemes and establish proofs of concept for future tech nodes.
• Participate in quarterly yield summits and monthly program reviews to summarize issues and actions to senior management.
• Assist in transfer of new technology from R&D to manufacturing; support ramp-up and qualification.

Skills

Data analysis

Cross-functional collaboration

Communication skills

Quality mindset

Self-motivation

Willingness to travel

Problem solving

Education

Electrical Engineering

Microelectronics

Chemical Engineering

Material Science

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams
• Assist in the transfer of new technology from R&D to manufacturing
• Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing
• Artificial Intelligence Using, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams.

Successful candidates for this position,

Must Have

• Passion in semiconductor technology and innovation
• Adept at data analysis, problem-solving, and process integration optimization
• Excellent communication skills and ability to work in cross-functional teams
• Committed to quality, collaboration, and continuous improvement
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment
• Ability to travel for extended periods to the US for collaborative R&D work

Requirements

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc.
• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable
• Exposure to R&D (such as HKMG) and transfer/manufacturing is desirable