NTI NAND Senior/Principal Process Integration Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology Inc. Singapore R&D is seeking a Senior/Principal NAND Module Process Integration Engineer to design, develop, integrate, and implement innovative process solutions aimed at improving next-generation 3D NAND yield and quality within required timelines.

The role requires leading cross-functional teams, defining performance criteria, coordinating site activities, and applying AI to streamline workflows and data-driven decisions across R&D, Product Engineering and

Qualifications

• BS, MS or PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or related field.
• Minimum 3 years in semiconductor Process Integration and Yield Enhancement.
• Proficiency in scripting/analytics tools (Python, Tableau, Power BI) desirable.
• Strong data analysis, problem-solving and cross-functional collaboration.
• Exposure to NAND technologies and HKMG is desirable.

Responsibilities

• Identify module deficiencies and lead cross-functional teams to address issues.
• Define CSPEC criteria for optimal product performance and process capability.
• Coordinate site activities to secure funding for experiments and transfers.
• Develop integration schemes for new NAND node types and proof concepts.
• Lead quarterly yield reviews and monthly program updates with leadership.
• Assist transfer of new technology from R&D to manufacturing.
• Support ramp-up, qualification and documentation for manufacturing transfer.
• Apply AI to streamline workflows and enable data-driven decisions.

Skills

Data analysis

Problem-solving

Cross-functional teamwork

Communication skills

Self-motivated

Education

BS/MS/PhD in Electrical Engineering or related

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability

• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability

• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners

• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility

• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams

• Assist in the transfer of new technology from R&D to manufacturing

• Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing

• Artificial Intelligence
  Using, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams.

Successful candidates for this position,

Must have:

• Passion in semiconductor technology and innovation

• Adept at data analysis, problem-solving, and process integration optimization

• Excellent communication skills and ability to work in cross-functional teams

• Committed to quality, collaboration, and continuous improvement

• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment

• Ability to travel for extended periods to the US for collaborative R&D work

Requirements:

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable

• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement

• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms

• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable

• Exposure to R&D (such as HKMG) and transfer/manufacturing is desirable