HBM Reliability & Process Innovation Engineer

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Engineer for HIG HBM reliability and test flow development.

You will define and develop reliability stress tests, qualification plans, and drive improvements across DPM, EFA/PFA analyses, and cross-functional teams. The role involves process conversions, risk management, and collaboration with Fab, HBM Tech Development, Design, System Development, and Quality/Reliability.

Qualifications

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field.
• Exposure to CMOS technology, DRAM architecture, and device physics is desirable.
• Experience with data analysis, statistics, and scripting tools such as Python or JMP.
• Strong problem-solving mindset and attention to detail; effective in team settings.

Responsibilities

• Define and develop reliability stress, test flows and test plans for product reliability.
• Define qualification plan, review progress, and drive gating issue resolution with Global Quality.
• Drive down Extrinsic/Intrinsic DPM through optimized manufacturing test flows and strategy.
• Debug root causes in reliability tests using EFA and PFA; drive improvements cross-functionally.
• Provide recommendations for high-volume manufacturing process conversions to reduce cost and improve yields.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.

Skills

Root cause analysis

Problem solving

Strong communication

Team collaboration

Attention to detail

Education

Bachelor’s or Master’s degree in Electrical and Electronics Engineering

Tools

Python

Job description

Micron Technology, Inc. in Singapore is seeking an Engineer for HIG HBM reliability and test flow development.

You will define and develop reliability stress tests, qualification plans, and drive improvements across DPM, EFA/PFA analyses, and cross-functional teams. The role involves process conversions, risk management, and collaboration with Fab, HBM Tech Development, Design, System Development, and Quality/Reliability.