Senior Engineer/Engineer, Thin Film Equipmemt

Vanguard International Semiconductor Corporation; Singapore; Presencial; SGD 80.000 - 110.000; Jornada completa

Descripción de la vacante

Vanguard International Semiconductor Corporation in Singapore is seeking an Engineer to own, sustain and improve equipment indices including quality, uptime and cost. You will coordinate with process and manufacturing Engineers to ensure efficient work and maintain preventive maintenance programs.

You will mentor junior engineers, document corrective actions and participate in CIP programs to optimize tooling performance and asset utilization.

Formación

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering.
• Minimum 3 years of wafer fabrication experience with Thin Film Equipment (CVD/PVD).
• Proficient in MS Office with good interpersonal and written skills.
• Strong analytical and leadership abilities with ownership and accountability.
• Ability to adapt in a fast-paced environment and work under pressure.

Responsabilidades

• Own, maintain and improve equipment indices: quality, uptime and cost.
• Sustain equipment KPI and drive continuous performance improvements.
• Coordinate with process and manufacturing engineers to meet module objectives.
• Plan and manage preventive maintenance programs on equipment.
• Coach and mentor subordinates and provide feedback on performance.
• Document corrective actions and share best practices for ROI and learning.
• Participate in CIP programs to optimize equipment utilization and maintenance cost.
• Become the technical expert for the machine specialization.

Conocimientos

Analytical thinking

Leadership

Communication skills

Integrity

Ownership

Educación

Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering

Herramientas

MS Office

Descripción del empleo

Job Description:

• To own, maintain and improve the following indices: Quality, Uptime and Cost.
• Sustain equipment KPI and make continuous improvements to enhance the performance.
• Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.
• Coordinate with both process and manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.
• Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.
• Manage the expenditure allocated for equipment maintenance without compromising on quality output.
• Continuous improvement of equipment KPI in terms of quality, uptime and costs.
• Plan and implement an effective Preventive Maintenance program on equipment.
• Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.
• Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.
• Participate in CIP programs to optimize equipment utilization and cost of maintenance.
• Become the technical Expert for the respective machine specialization.
• Monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments.
• Know how to use measurement instruments effectively in data collection.
• Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool
• weaknesses and derive the top 3 to 5 risk factors.
• Able to create PROMIS (SiView) DC OP and SPC charts.
• Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of
• equipment for production.
• Wafer scrap reduction awareness and mindset.
• Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance
• to Junior Engineers.
• Self audit and update specifications to meet TS16949 Quality Standard requirements.
• Set Expectation and carry out performance appraisal for Technician or AE as instructed by
• Section Manager.

Requirements:

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
• Min3 years of relevant work experience Wafer fabrication and experience inhandlingThin Film Equipment (CVD/PVD).
• Goodteam player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications